Presentation | 1999/2/12 High Frequency Fundamental Crystal Resonators by Gold Bump Bonding Hirokazu IWATA, Osamu ISHII, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | This paper describes a supporting structure of surface mount type crystal resonators suitable for higher frequency. The supporting structure improved gold bumps to connect a crystal chip with a ceramic package. In this paper, gold bump bonding is applied to AT-cut high frequency fundamental crystal resonators which have the extremely thin vibrating area. The effectiveness of gold bump bonding is tested by experiment. The 155MHz resonators, prevent generation of internal stress in the crystal chip, demonstrate stable characteristics as the frequency shift remain at less than +/- 1 ppm in an accelerated aging test. The 622MHz resonators, avert decrease of conductivity during high frequency operation, are characterized by a reduction of 25% in the crystal impedance as compared with the one using conductive adhesive junction. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Goldbump / AT-cut / Fundamental / Crystal resonator / Conductive adhesive |
Paper # | US98-103 |
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Conference Information | |
Committee | US |
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Conference Date | 1999/2/12(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Ultrasonics (US) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | High Frequency Fundamental Crystal Resonators by Gold Bump Bonding |
Sub Title (in English) | |
Keyword(1) | Goldbump |
Keyword(2) | AT-cut |
Keyword(3) | Fundamental |
Keyword(4) | Crystal resonator |
Keyword(5) | Conductive adhesive |
1st Author's Name | Hirokazu IWATA |
1st Author's Affiliation | Central Research Liboratories, Toyo Communication Equipment Co., Ltd.() |
2nd Author's Name | Osamu ISHII |
2nd Author's Affiliation | Central Research Liboratories, Toyo Communication Equipment Co., Ltd. |
Date | 1999/2/12 |
Paper # | US98-103 |
Volume (vol) | vol.98 |
Number (no) | 587 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |