Presentation 1999/2/12
High Frequency Fundamental Crystal Resonators by Gold Bump Bonding
Hirokazu IWATA, Osamu ISHII,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This paper describes a supporting structure of surface mount type crystal resonators suitable for higher frequency. The supporting structure improved gold bumps to connect a crystal chip with a ceramic package. In this paper, gold bump bonding is applied to AT-cut high frequency fundamental crystal resonators which have the extremely thin vibrating area. The effectiveness of gold bump bonding is tested by experiment. The 155MHz resonators, prevent generation of internal stress in the crystal chip, demonstrate stable characteristics as the frequency shift remain at less than +/- 1 ppm in an accelerated aging test. The 622MHz resonators, avert decrease of conductivity during high frequency operation, are characterized by a reduction of 25% in the crystal impedance as compared with the one using conductive adhesive junction.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Goldbump / AT-cut / Fundamental / Crystal resonator / Conductive adhesive
Paper # US98-103
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Committee US
Conference Date 1999/2/12(1days)
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Paper Information
Registration To Ultrasonics (US)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High Frequency Fundamental Crystal Resonators by Gold Bump Bonding
Sub Title (in English)
Keyword(1) Goldbump
Keyword(2) AT-cut
Keyword(3) Fundamental
Keyword(4) Crystal resonator
Keyword(5) Conductive adhesive
1st Author's Name Hirokazu IWATA
1st Author's Affiliation Central Research Liboratories, Toyo Communication Equipment Co., Ltd.()
2nd Author's Name Osamu ISHII
2nd Author's Affiliation Central Research Liboratories, Toyo Communication Equipment Co., Ltd.
Date 1999/2/12
Paper # US98-103
Volume (vol) vol.98
Number (no) 587
Page pp.pp.-
#Pages 6
Date of Issue