| Presentation | 1993/11/26 Finite element simulation of ultrasonic plastic welding process Ei'ichi Ando, Yukio Kagawa, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Ultrasonic welding has been utilized for plastic bonding as it does not require adhesive.The mechanism of ultrasonic plastic welding is not yet well understood.The application of the finite element method to a transient heat response problem in a plastic piece during its bonding process is described.Temperature is known to play an important role in welding.The temperature distribution and the thermal deformation in the plastic piece are of practical important for the design of the ultrasonic welding system.The mechanical vibratory loss in the material is considered for the cause of the heat.A finite element model is proposed for the temperature change and deformation in the plastic piece with time. Simulation is made for an ABS plastic test piece,for which discussion is made the with experimental data. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Ultrasonic / Plastic welding / Finite element simulation / Transient heat conduction / Temperature distribution |
| Paper # | US93-66 |
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| Conference Information | |
| Committee | US |
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| Conference Date | 1993/11/26(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
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| Assistant | |
| Paper Information | |
| Registration To | Ultrasonics (US) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Finite element simulation of ultrasonic plastic welding process |
| Sub Title (in English) | |
| Keyword(1) | Ultrasonic |
| Keyword(2) | Plastic welding |
| Keyword(3) | Finite element simulation |
| Keyword(4) | Transient heat conduction |
| Keyword(5) | Temperature distribution |
| 1st Author's Name | Ei'ichi Ando |
| 1st Author's Affiliation | SPC Electronic Corporation() |
| 2nd Author's Name | Yukio Kagawa |
| 2nd Author's Affiliation | Faculty of Engineering,Okayama University |
| Date | 1993/11/26 |
| Paper # | US93-66 |
| Volume (vol) | vol.93 |
| Number (no) | 354 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |