Presentation 1995/7/26
Fabrication of High-Quality Deep Submicron Nb/AlOx/Nb Josephson Junctions Using FINP
N. Nagai, F. Furuta, H. Akaike, A. Fujimaki, H. Hayakawa,
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Abstract(in English) We have successfully fabricated high-quality 0.1μm^2 Nb/AlOx/Nb junctions with critical current Ic of 10μA using Focused ion beam Implanted Nb Patterning (FINP) technique for defining the counter electrodes. These junctions were obtained by insertion of a buffer layer in the counter electrode. The junctions without the buffer layer often showed leaky characteristics, which indicated that the implanted ions damaged the tunnel barrier. On the other hand, when the buffer layer was used, the high-quality junctions were obtained with good reproducibility. This result means that the buffer layer is effective to prevent implanted ions from damaging the tunnel barrier
Keyword(in Japanese) (See Japanese page)
Keyword(in English) FIB / FINP / high-quality / buffer layer / tunnel barrier
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Committee SCE
Conference Date 1995/7/26(1days)
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Registration To Superconductive Electronics (SCE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Fabrication of High-Quality Deep Submicron Nb/AlOx/Nb Josephson Junctions Using FINP
Sub Title (in English)
Keyword(1) FIB
Keyword(2) FINP
Keyword(3) high-quality
Keyword(4) buffer layer
Keyword(5) tunnel barrier
1st Author's Name N. Nagai
1st Author's Affiliation Nagoya University, Department of Electronics Engineering()
2nd Author's Name F. Furuta
2nd Author's Affiliation Nagoya University, Department of Electronics Engineering
3rd Author's Name H. Akaike
3rd Author's Affiliation Nagoya University, Department of Electronics Engineering
4th Author's Name A. Fujimaki
4th Author's Affiliation Nagoya University, Department of Electronics Engineering
5th Author's Name H. Hayakawa
5th Author's Affiliation Nagoya University, Department of Electronics Engineering
Date 1995/7/26
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Volume (vol) vol.95
Number (no) 186
Page pp.pp.-
#Pages 6
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