Presentation 1995/4/26
Characterization of Buried Microstrip Lines for Constructing High-Density Microwave Integrated Circuits
Takahide Ishikawa, Eikichi Yamashita,
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Abstract(in English) This paper describes the characterization of a guided wave structure, Buried Microstrip Line (BMSL), which is considered to be promising for constructing high-density microwave and millimeter-wave integrated circuits because of its high isolation characteristics. The BMSL structure is characterized by the two methods, the Rectangular Boundary Division (RBD) method and the Finite Difference Time Domain (FD-TD) method. The analysis results reveal that the BMSL structure possesses much lower coupling coefficients than conventional microstrip line does, from -15dB to -100dB depending on their burial depths.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Buried Microstrip Line / Rectangular Boundary Division Method / FDTD method / Isolation
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Committee SCE
Conference Date 1995/4/26(1days)
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Registration To Superconductive Electronics (SCE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Characterization of Buried Microstrip Lines for Constructing High-Density Microwave Integrated Circuits
Sub Title (in English)
Keyword(1) Buried Microstrip Line
Keyword(2) Rectangular Boundary Division Method
Keyword(3) FDTD method
Keyword(4) Isolation
1st Author's Name Takahide Ishikawa
1st Author's Affiliation Optoelectronic and Microwave Devices Laboratory, Mitsubishi Electric Corporation()
2nd Author's Name Eikichi Yamashita
2nd Author's Affiliation Department of Electronic Engineering, University of Electro-Communications
Date 1995/4/26
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Volume (vol) vol.95
Number (no) 18
Page pp.pp.-
#Pages 6
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