Presentation 2002/1/10
Soft Magnetic Properties of FeCo Film Prepared using UHV Sputtering Process and Application to Single Pole Head
Hiroyuki KATADA, Takehito SHIMATSU, Masaharu TAKAHASHI, Isao WATANABE, Hiroaki MURAOKA, Yoshihisa NAKAMURA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The soft magnetic properties of NiFe/FeCo/NiFe sandwich films with high saturation magnetization are discussed in relation to the microstructure. Ta/NiFe/FeCo/NiFe/Ta films prepared using the UHV sputtering process show a very sharp fiber texture of bcc-<110> in the FeCo layer. It was revealed that thin NiFe film with a thickness of only 3 nm works effectively as a seed layer of FeCo film to control the microstructure, resulting in a significant reduction of the coercivity. The best thickness of the FeCo layer in order to realize both soft magnetic properties and high saturation magnetization was found to be ~100nm. It was fond that [FeCo/NiFe]_4 single pole head using bulk coil showed better overwrite performance than that of CoZrNb head.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) FeCo films / high saturation magnetization / soft magnetic properties / single pole head / saturation curve / overwrite performance
Paper # 2001-MR-91
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Committee MR
Conference Date 2002/1/10(1days)
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Registration To Magnetic Recording (MR)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Soft Magnetic Properties of FeCo Film Prepared using UHV Sputtering Process and Application to Single Pole Head
Sub Title (in English)
Keyword(1) FeCo films
Keyword(2) high saturation magnetization
Keyword(3) soft magnetic properties
Keyword(4) single pole head
Keyword(5) saturation curve
Keyword(6) overwrite performance
1st Author's Name Hiroyuki KATADA
1st Author's Affiliation Research Institute of Electrical Communication, Tohoku University()
2nd Author's Name Takehito SHIMATSU
2nd Author's Affiliation Research Institute of Electrical Communication, Tohoku University
3rd Author's Name Masaharu TAKAHASHI
3rd Author's Affiliation Research Institute of Electrical Communication, Tohoku University
4th Author's Name Isao WATANABE
4th Author's Affiliation Research Institute of Electrical Communication, Tohoku University
5th Author's Name Hiroaki MURAOKA
5th Author's Affiliation Research Institute of Electrical Communication, Tohoku University
6th Author's Name Yoshihisa NAKAMURA
6th Author's Affiliation Research Institute of Electrical Communication, Tohoku University
Date 2002/1/10
Paper # 2001-MR-91
Volume (vol) vol.101
Number (no) 564
Page pp.pp.-
#Pages 8
Date of Issue