Presentation 2001/11/1
Measuring the thickness and thickness uniformity of ultra-thin AlO_x films in magnetic tunneling junctions by combined RBS and conducting atomic force microscopy
E.Z. Luo, S.K. Wong, A.B. Pakhomov, B. Sundaravel, J.B. Xu, I.H. Wilson, C.Y. Wong,
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Abstract(in English) In this article, we present a study to measure average thickness and as well as the thickness uniformity of the ultra-thin AlO_x barrier layer by combined RBS and conducting atomic force microscopy(C-AFM). RBS in tilted angle geometry was used to determine the average thickness on a macroscopic scale. By carefully analyzing the variation of energy width of Al spectra with tilt angle, the average thickness of AlO_x layers has been quantitatively determined. The thickness and thickness uniformity on a microscopic scale was measured by C-AFM. The errors of both techniques will also be discussed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) RBS / conducting AFM / Magnetic tunneling junctions
Paper # MR2001-57
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Committee MR
Conference Date 2001/11/1(1days)
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Registration To Magnetic Recording (MR)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Measuring the thickness and thickness uniformity of ultra-thin AlO_x films in magnetic tunneling junctions by combined RBS and conducting atomic force microscopy
Sub Title (in English)
Keyword(1) RBS
Keyword(2) conducting AFM
Keyword(3) Magnetic tunneling junctions
1st Author's Name E.Z. Luo
1st Author's Affiliation Department of Electronic Engineering, The Chinese University of Hong Kong()
2nd Author's Name S.K. Wong
2nd Author's Affiliation Materials Characterization and Preparation Facility Hong Kong University of Science and technology
3rd Author's Name A.B. Pakhomov
3rd Author's Affiliation Materials Characterization and Preparation Facility Hong Kong University of Science and technology
4th Author's Name B. Sundaravel
4th Author's Affiliation Department of Electronic Engineering, The Chinese University of Hong Kong
5th Author's Name J.B. Xu
5th Author's Affiliation Department of Electronic Engineering, The Chinese University of Hong Kong
6th Author's Name I.H. Wilson
6th Author's Affiliation Department of Electronic Engineering, The Chinese University of Hong Kong
7th Author's Name C.Y. Wong
7th Author's Affiliation Materials Characterization and Preparation Facility Hong Kong University of Science and technology
Date 2001/11/1
Paper # MR2001-57
Volume (vol) vol.101
Number (no) 400
Page pp.pp.-
#Pages 5
Date of Issue