| Presentation | 1999/3/18 Stress Analysis of "Micro-Bump Bonding" Structure for "Chip on Glass" Packaging Shyh-Ming Chang, Jwo-Huei Jou, Hua-Shu Wu, Hong-Yu Lin, Chi-Yuan Wu, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Micro-Bump Bonding (MBB) method makes possible the micro-order direct bonding between IC electrode and circuit substrate electrode. The technology consists of three elements: an IC chip with bumps, a circuit substrate, and a bonding adhesive. The binding forces of the applied adhesive accomplish electrical connection between the bumps on the IC chip and the electrodes on the substrate. Stress analysis is made to estimate the contact force that the adhesive imposes to drag together the bumps of the IC and the electrodes of the substrate. An elastic model is assumed herein to determine the stress characteristic of the MBB structure. The stresses of the structures with gold bumps and compliant bumps are compared at various temperatures. Such a stress analysis is helpful in determining which kind of bumps is more suitable for a given MBB structure. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | |
| Paper # | EID98-214 |
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| Conference Information | |
| Committee | EID |
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| Conference Date | 1999/3/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Electronic Information Displays (EID) |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Stress Analysis of "Micro-Bump Bonding" Structure for "Chip on Glass" Packaging |
| Sub Title (in English) | |
| Keyword(1) | |
| 1st Author's Name | Shyh-Ming Chang |
| 1st Author's Affiliation | LCD Development Division, Electronics Research and Service Organization, Industrial Technology Research Institute:Department of Material Science and Engineering, National Tsing-Hua University() |
| 2nd Author's Name | Jwo-Huei Jou |
| 2nd Author's Affiliation | Department of Material Science and Engineering, National Tsing-Hua University |
| 3rd Author's Name | Hua-Shu Wu |
| 3rd Author's Affiliation | Department of Material Science and Engineering, National Tsing-Hua University |
| 4th Author's Name | Hong-Yu Lin |
| 4th Author's Affiliation | LCD Development Division, Electronics Research and Service Organization, Industrial Technology Research Institute |
| 5th Author's Name | Chi-Yuan Wu |
| 5th Author's Affiliation | LCD Development Division, Electronics Research and Service Organization, Industrial Technology Research Institute |
| Date | 1999/3/18 |
| Paper # | EID98-214 |
| Volume (vol) | vol.98 |
| Number (no) | 665 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |