| Presentation | 1999/3/18 Vacuum Packaging using Anodic Bonding and Emission Characteristics of FED Duck-Jung Lee, Byeong-Kwon Ju, Jee-Won Jeong, Hoon Kim, Sung-Jae Jung, Jin Jang, Myung-Hwan Oh, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In this paper, we suggest the FED packaging technology using anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonded. Glass-glass bonding is based on conventional silicon-glass bonding mechanism and achieved successfully. The FED panel having opened exhausting hole was formed by glass frit process and sealed by capping glass. From the leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED, then anode current was 34μA. Emission stability was constantly measured for 11 hours. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Glass bonding / Silicon film / Leak test / Packaged FED / Light emission / Stability |
| Paper # | EID98-208 |
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| Conference Information | |
| Committee | EID |
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| Conference Date | 1999/3/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electronic Information Displays (EID) |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Vacuum Packaging using Anodic Bonding and Emission Characteristics of FED |
| Sub Title (in English) | |
| Keyword(1) | Glass bonding |
| Keyword(2) | Silicon film |
| Keyword(3) | Leak test |
| Keyword(4) | Packaged FED |
| Keyword(5) | Light emission |
| Keyword(6) | Stability |
| 1st Author's Name | Duck-Jung Lee |
| 1st Author's Affiliation | Electronic Materials and Devices Research Center Korea Institute of Science and Technology() |
| 2nd Author's Name | Byeong-Kwon Ju |
| 2nd Author's Affiliation | Electronic Materials and Devices Research Center Korea Institute of Science and Technology |
| 3rd Author's Name | Jee-Won Jeong |
| 3rd Author's Affiliation | Electronic Materials and Devices Research Center Korea Institute of Science and Technology |
| 4th Author's Name | Hoon Kim |
| 4th Author's Affiliation | Electronic Materials and Devices Research Center Korea Institute of Science and Technology |
| 5th Author's Name | Sung-Jae Jung |
| 5th Author's Affiliation | Orion Electric Co. Ltd. |
| 6th Author's Name | Jin Jang |
| 6th Author's Affiliation | Department of Physics, Kyunghee University |
| 7th Author's Name | Myung-Hwan Oh |
| 7th Author's Affiliation | Electronic Materials and Devices Research Center Korea Institute of Science and Technology |
| Date | 1999/3/18 |
| Paper # | EID98-208 |
| Volume (vol) | vol.98 |
| Number (no) | 665 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |