| Presentation | 1999/8/27 High accurate self-aligned bonding for wafer level assembly H. Nakata, G. Nakagawa, h. Nobuhara, K. Tanaka, M. Yano, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Wafer level assembly is a promising candidate for low-cost assembly of optical modules. Self-aligned bonding using solder surface tension which is an important technology in this assembly was studied. For improvement of bonding accuracy in horizontal direction, we adopted many small solder bumps for bonding of a chip and reflow process with strong deoxidization effect. For improvement of bonding accuracy in vertical direction, we adopted high accurate fabrication process of solder bumps. Consequently, we achieved submicron bonding accuracy in both horizontal and vertical directions. The tolerance at initial placement was 25μm which is about a half of bonding-pad diameter. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | wafer level assembly / self-aligned / bonding / submicron / accuracy / solder bump |
| Paper # | LQE99-50 |
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| Conference Information | |
| Committee | LQE |
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| Conference Date | 1999/8/27(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Lasers and Quantum Electronics (LQE) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | High accurate self-aligned bonding for wafer level assembly |
| Sub Title (in English) | |
| Keyword(1) | wafer level assembly |
| Keyword(2) | self-aligned |
| Keyword(3) | bonding |
| Keyword(4) | submicron |
| Keyword(5) | accuracy |
| Keyword(6) | solder bump |
| 1st Author's Name | H. Nakata |
| 1st Author's Affiliation | Fujitsu Laboratories Ltd.() |
| 2nd Author's Name | G. Nakagawa |
| 2nd Author's Affiliation | Fujitsu Laboratories Ltd. |
| 3rd Author's Name | h. Nobuhara |
| 3rd Author's Affiliation | Fujitsu Laboratories Ltd. |
| 4th Author's Name | K. Tanaka |
| 4th Author's Affiliation | Fujitsu Laboratories Ltd. |
| 5th Author's Name | M. Yano |
| 5th Author's Affiliation | Fujitsu Laboratories Ltd. |
| Date | 1999/8/27 |
| Paper # | LQE99-50 |
| Volume (vol) | vol.99 |
| Number (no) | 280 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |