Presentation 1999/8/27
Surface pretreatment in wafer direct bonding for integrated optical isolator
Hideki YOKOI, Tetsuya MIZUMOTO, Masafumi SHIMIZU, Takashi WANIISHI, Naoki FUTAKUCHI, Noriaki KAIDA, Yoshiaki NAKANO,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) An integrated optical isolator with a semiconductor guiding layer can be constructed by wafer direct bonding technique, by which two wafers are contacted without any adhesives. The direct bonding between GalnAsP and garnet crystals has been investigated to realize the integrated optical isolator employing a nonreciprocal phase shift. Experimental results of contact angle measurement of wafer surfaces with various treatments for the direct bonding are described.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Optical isolator / direct bonding / semiconductor / garnet / contact angle measurement
Paper # LQE99-48
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Conference Information
Committee LQE
Conference Date 1999/8/27(1days)
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Paper Information
Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Surface pretreatment in wafer direct bonding for integrated optical isolator
Sub Title (in English)
Keyword(1) Optical isolator
Keyword(2) direct bonding
Keyword(3) semiconductor
Keyword(4) garnet
Keyword(5) contact angle measurement
1st Author's Name Hideki YOKOI
1st Author's Affiliation Department of Physical Electronics, Faculty of Engineering, Tokyo lnstitute of Technology()
2nd Author's Name Tetsuya MIZUMOTO
2nd Author's Affiliation Department of Physical Electronics, Faculty of Engineering, Tokyo lnstitute of Technology
3rd Author's Name Masafumi SHIMIZU
3rd Author's Affiliation Department of Physical Electronics, Faculty of Engineering, Tokyo lnstitute of Technology
4th Author's Name Takashi WANIISHI
4th Author's Affiliation Department of Physical Electronics, Faculty of Engineering, Tokyo lnstitute of Technology
5th Author's Name Naoki FUTAKUCHI
5th Author's Affiliation Department of Electronic Engineering, School of Engineering, The University of Tokyo
6th Author's Name Noriaki KAIDA
6th Author's Affiliation Department of Electronic Engineering, School of Engineering, The University of Tokyo
7th Author's Name Yoshiaki NAKANO
7th Author's Affiliation Department of Electronic Engineering, School of Engineering, The University of Tokyo
Date 1999/8/27
Paper # LQE99-48
Volume (vol) vol.99
Number (no) 280
Page pp.pp.-
#Pages 6
Date of Issue