Presentation | 1998/8/27 Bonding technique and applications using transferred microsolder bumps Nobutatsu Koshoubu, Hideki Tsunetsugu, Masakaze Hosoya, Suzuko Ishizawa, Hideyuki Takahara, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | To eliminate the damage that is caused by stress during vapor-phase deposition of the solder materials, we have developed a flip-chip-bonding technique that uses transferred microsolder bumps with a diameter of about 26 and 40 μm. We used solder materials of 100% In and 60% Sn-Pb in our experiments. From 9 to 546 transferred microsolder bumps were successfully formed on 0.5-to 4-mm^2 chips. By repeating the transferred process, the microsolder bump thickness from 25 to 45 μm and volume could be controlled by increasing the number of the transferred process. We confirmed the usefulness of this bonding technique to enable the many applications of various high-speed electrical and/or photonic devices in conjunction with high-density interconnections. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | interconnection / microsolder bump / broadband module |
Paper # | EMD98-31, CPM98-79, OPE98-52, LQE98-46 |
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Conference Information | |
Committee | LQE |
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Conference Date | 1998/8/27(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Lasers and Quantum Electronics (LQE) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Bonding technique and applications using transferred microsolder bumps |
Sub Title (in English) | |
Keyword(1) | interconnection |
Keyword(2) | microsolder bump |
Keyword(3) | broadband module |
1st Author's Name | Nobutatsu Koshoubu |
1st Author's Affiliation | NTT Opto-electronics Laboratories() |
2nd Author's Name | Hideki Tsunetsugu |
2nd Author's Affiliation | NTT Opto-electronics Laboratories |
3rd Author's Name | Masakaze Hosoya |
3rd Author's Affiliation | NTT Opto-electronics Laboratories |
4th Author's Name | Suzuko Ishizawa |
4th Author's Affiliation | NTT Opto-electronics Laboratories |
5th Author's Name | Hideyuki Takahara |
5th Author's Affiliation | NTT Opto-electronics Laboratories |
Date | 1998/8/27 |
Paper # | EMD98-31, CPM98-79, OPE98-52, LQE98-46 |
Volume (vol) | vol.98 |
Number (no) | 255 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |