Presentation 1998/8/27
Bonding technique and applications using transferred microsolder bumps
Nobutatsu Koshoubu, Hideki Tsunetsugu, Masakaze Hosoya, Suzuko Ishizawa, Hideyuki Takahara,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) To eliminate the damage that is caused by stress during vapor-phase deposition of the solder materials, we have developed a flip-chip-bonding technique that uses transferred microsolder bumps with a diameter of about 26 and 40 μm. We used solder materials of 100% In and 60% Sn-Pb in our experiments. From 9 to 546 transferred microsolder bumps were successfully formed on 0.5-to 4-mm^2 chips. By repeating the transferred process, the microsolder bump thickness from 25 to 45 μm and volume could be controlled by increasing the number of the transferred process. We confirmed the usefulness of this bonding technique to enable the many applications of various high-speed electrical and/or photonic devices in conjunction with high-density interconnections.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) interconnection / microsolder bump / broadband module
Paper # EMD98-31, CPM98-79, OPE98-52, LQE98-46
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Conference Information
Committee LQE
Conference Date 1998/8/27(1days)
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Paper Information
Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Bonding technique and applications using transferred microsolder bumps
Sub Title (in English)
Keyword(1) interconnection
Keyword(2) microsolder bump
Keyword(3) broadband module
1st Author's Name Nobutatsu Koshoubu
1st Author's Affiliation NTT Opto-electronics Laboratories()
2nd Author's Name Hideki Tsunetsugu
2nd Author's Affiliation NTT Opto-electronics Laboratories
3rd Author's Name Masakaze Hosoya
3rd Author's Affiliation NTT Opto-electronics Laboratories
4th Author's Name Suzuko Ishizawa
4th Author's Affiliation NTT Opto-electronics Laboratories
5th Author's Name Hideyuki Takahara
5th Author's Affiliation NTT Opto-electronics Laboratories
Date 1998/8/27
Paper # EMD98-31, CPM98-79, OPE98-52, LQE98-46
Volume (vol) vol.98
Number (no) 255
Page pp.pp.-
#Pages 6
Date of Issue