Presentation 1997/6/17
High-quality deep etching of GaN by VUV-UV multi wave length laser ablation
J Zhang, K Sugioka, S Wada, H Tashiro, K Toyoda,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) High-quality deep etching of GaN thin film by 266nm laser ablation coupled with a vacuum ultraviolet(VUV) Raman laser(133-184nm), followed by treatment in HCl solution, was achieved. The etch rate was as high as 55nm/pulse. Scanning electron microscopy and scanning probe microscopy measurement results indicate that the surface of the etched films was structurally well defined and cleanly patterned. Micro-photoluminescence measurement of ablated samples revealed no severe damage to the optical properties or the crystal structure. The mechanism of VUV-266nm laser ablation of GaN is discussed based on the band structure of GaN.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) GaN / multi wave lenght laser / etching / photoluminescence.
Paper # LQE97-28
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Conference Information
Committee LQE
Conference Date 1997/6/17(1days)
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Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High-quality deep etching of GaN by VUV-UV multi wave length laser ablation
Sub Title (in English)
Keyword(1) GaN
Keyword(2) multi wave lenght laser
Keyword(3) etching
Keyword(4) photoluminescence.
1st Author's Name J Zhang
1st Author's Affiliation Institute of Physical and Chemical Research (RIKEN)()
2nd Author's Name K Sugioka
2nd Author's Affiliation Institute of Physical and Chemical Research (RIKEN)
3rd Author's Name S Wada
3rd Author's Affiliation Institute of Physical and Chemical Research (RIKEN)
4th Author's Name H Tashiro
4th Author's Affiliation Institute of Physical and Chemical Research (RIKEN)
5th Author's Name K Toyoda
5th Author's Affiliation Institute of Physical and Chemical Research (RIKEN)
Date 1997/6/17
Paper # LQE97-28
Volume (vol) vol.97
Number (no) 100
Page pp.pp.-
#Pages 7
Date of Issue