Presentation 1997/7/25
New 3-D Inter-Module Packaging Technology for On-Board Phased Array BFN Equipment
Fuminori ISHITSUKA, Noboru IWASAKI, Takashi OHIRA, Yoshinori SUZUKI, Yasuhiro ANDO,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) A new, compact 3-D inter-module microwave packaging technology is proposed in order to drastically reduce the volume of satellite on-board phased-array BFN equipment. By applying this technology to a S-band, 64-beam, 32-radiator array BFN prototype, a packaging unit with a volume of 2600 cc has been developed. This unit employs a super-fine pitch coaxial connector array, high I/O isolation MMIC packages, and high-performance power combiners. Isolation of an MMIC package is more than 60dB and a combiner has isolation over 30 dB.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) phased-array / Beamforming / 3-D inter-module packaging / Coaxial connector array
Paper # CQ97-30
Date of Issue

Conference Information
Committee CQ
Conference Date 1997/7/25(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Communication Quality (CQ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) New 3-D Inter-Module Packaging Technology for On-Board Phased Array BFN Equipment
Sub Title (in English)
Keyword(1) phased-array
Keyword(2) Beamforming
Keyword(3) 3-D inter-module packaging
Keyword(4) Coaxial connector array
1st Author's Name Fuminori ISHITSUKA
1st Author's Affiliation NTT Optoelectronics Labs()
2nd Author's Name Noboru IWASAKI
2nd Author's Affiliation NTT Optoelectronics Labs
3rd Author's Name Takashi OHIRA
3rd Author's Affiliation NTT Wireless Systems Labs
4th Author's Name Yoshinori SUZUKI
4th Author's Affiliation NTT Wireless Systems Labs
5th Author's Name Yasuhiro ANDO
5th Author's Affiliation NTT Optoelectronics Labs
Date 1997/7/25
Paper # CQ97-30
Volume (vol) vol.97
Number (no) 190
Page pp.pp.-
#Pages 6
Date of Issue