| Presentation | 2001/2/16 New power IC's for application using BCD, Hybrid and Surface mount technology respond for high voltage operation : Applications for automotive devices Isao BANSAKU, Nanjyo AOIKE, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | New IC technologies are opening up a range of high power high voltage automotive applications sigunificantly reducing parts count; vastly enhancing reliability & compactness. Recent trends in automotive electronics have been the move toward higher operating temperature and the future plan for high voltage power bus for cars. The paper describes a new combination of technologies, which together can solve the problems associated with these developments. First of all, a new set of 60V and 600V BCD processes is reported [1]. The paper then shows how these can be used in combination with IGBT & MOSFET power switches to produce a compact, coat effective and robust technology. These smart power hybrids can be packaged in a range of high voltage & high power surface mount packages. Finally the operating environment and needs of HID lamps are cited to illustrate how such a concept can work in practice. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Automobiles / Semiconductor / BCD process / Power IC / Surface mount / HID lamp |
| Paper # | EE2000-74 |
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| Conference Information | |
| Committee | EE |
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| Conference Date | 2001/2/16(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
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| Paper Information | |
| Registration To | Energy Engineering in Electronics and Communications (EE) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | New power IC's for application using BCD, Hybrid and Surface mount technology respond for high voltage operation : Applications for automotive devices |
| Sub Title (in English) | |
| Keyword(1) | Automobiles |
| Keyword(2) | Semiconductor |
| Keyword(3) | BCD process |
| Keyword(4) | Power IC |
| Keyword(5) | Surface mount |
| Keyword(6) | HID lamp |
| 1st Author's Name | Isao BANSAKU |
| 1st Author's Affiliation | Sanken Electric Co., Ltd.() |
| 2nd Author's Name | Nanjyo AOIKE |
| 2nd Author's Affiliation | Sanken Electric Co., Ltd. |
| Date | 2001/2/16 |
| Paper # | EE2000-74 |
| Volume (vol) | vol.100 |
| Number (no) | 628 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |