| Presentation | 1998/6/18 Hybrid integrated 4×4 matrix optical switch J. Sasaki, T. Kato, T. Shimoda, T. Tamanuki, H. Hatakeyama, S. Kitamura, N. Kitamura, M. Kitamura, M. Yamaguchi, M. Ito, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | High throughput telecommunication networks would require a large number of multi-channel optical matrix switches. In terms of mass-productivity and miniaturization, the most suitable way of producing practical modules would seems to be hybrid integration. We have developed a 4×4 gate matrix switch module by employing a newly developed self-align multiple chip assembly technique in the hybrid integration of semiconductor optical-amplifier gate arrays, printed wiring chips and optical fibers on a silica based planar lightwave circuit platform. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Optical packaging / Optical switch / Hybrid integration / Self-aligned assembly / SOA / PLC |
| Paper # | PS98-16,OFT98-17 |
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| Conference Information | |
| Committee | OFT |
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| Conference Date | 1998/6/18(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Optical Fiber Technology (OFT) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Hybrid integrated 4×4 matrix optical switch |
| Sub Title (in English) | |
| Keyword(1) | Optical packaging |
| Keyword(2) | Optical switch |
| Keyword(3) | Hybrid integration |
| Keyword(4) | Self-aligned assembly |
| Keyword(5) | SOA |
| Keyword(6) | PLC |
| 1st Author's Name | J. Sasaki |
| 1st Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation() |
| 2nd Author's Name | T. Kato |
| 2nd Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation |
| 3rd Author's Name | T. Shimoda |
| 3rd Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation |
| 4th Author's Name | T. Tamanuki |
| 4th Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation |
| 5th Author's Name | H. Hatakeyama |
| 5th Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation |
| 6th Author's Name | S. Kitamura |
| 6th Author's Affiliation | Compound Semiconductor Device Div. |
| 7th Author's Name | N. Kitamura |
| 7th Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation |
| 8th Author's Name | M. Kitamura |
| 8th Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation |
| 9th Author's Name | M. Yamaguchi |
| 9th Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation |
| 10th Author's Name | M. Ito |
| 10th Author's Affiliation | Opto-electronics and High Frequency Device Res.Labs., NEC Corporation |
| Date | 1998/6/18 |
| Paper # | PS98-16,OFT98-17 |
| Volume (vol) | vol.98 |
| Number (no) | 111 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |