| Presentation | 2001/12/14 Study of High-Density Printed Wiring Boards for Space Use Noriko YAMADA, Sumio MATSUDA, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Recently, the demand for very high-density printed wiring boards (PWBs), even for space use, has increased for high-pin-count-area array packages, such as ball grid arrays (BGAs), chip scale packages (CSPs), and multichip modules (MCMs). Build-up PWBs can be achieved high density and minimal interconnection length. In this study, we investigated the long-term reliability of build-up PWBs. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Build-up printed wiring board (PWB) High-density packaging / Space use / BGA / CSP Multi chip module (MCM) / Long-term reliability |
| Paper # | R2001-30,SSS2001-25 |
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| Conference Information | |
| Committee | SSS |
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| Conference Date | 2001/12/14(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Safety (SSS) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study of High-Density Printed Wiring Boards for Space Use |
| Sub Title (in English) | |
| Keyword(1) | Build-up printed wiring board (PWB) High-density packaging |
| Keyword(2) | Space use |
| Keyword(3) | BGA |
| Keyword(4) | CSP Multi chip module (MCM) |
| Keyword(5) | Long-term reliability |
| 1st Author's Name | Noriko YAMADA |
| 1st Author's Affiliation | National Space Development Agency of Japan (NASDA)() |
| 2nd Author's Name | Sumio MATSUDA |
| 2nd Author's Affiliation | National Space Development Agency of Japan (NASDA) |
| Date | 2001/12/14 |
| Paper # | R2001-30,SSS2001-25 |
| Volume (vol) | vol.101 |
| Number (no) | 527 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |