| Presentation | 2004/4/16 Opto-electronic Chip-on-film(OE-COF) Packaging Technology "Single-mode Polyimide Optical Waveguide Films with Low Coefficients of Thermal Expansion" Mitsuo USUI, Hirooki HIRATA, Suzuko ISHIZAWA, Nobutatsu KOSHOUBU, Tsuyoshi HAYASHI, Shigehisa OHKI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | OE-COF packaging technology, including flip-chip bonded optical devices and LSIs on the fluorinated polyimide optical waveguide film with impedance-matched electrical lines, was developed for high-speed transceiver modules. We have developed a new type of single-mode optical waveguide film with a low coefficient of thermal expansion (CTE). The low-CTE film was fabricated by sandwiching a fluorinated polyimide optical waveguide film between low-CTE polyimide layers. Its CTE is less than one-tenth that of conventional polyimide optical waveguide films. We fabricated opto-electronic (OE) films with coplanar waveguide (CPW) lines on the film surface using this low-CTE film. We confirmed that the film has good optical and electrical characteristics. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | OE-COF packaging / Solder bump / OE film / Fluorinated polyimide / Single-mode / Coplanar waveguide(CPW) |
| Paper # | R2004-1,CPM2004-1,OPE2004-1 |
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| Conference Information | |
| Committee | OPE |
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| Conference Date | 2004/4/16(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Optoelectronics (OPE) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Opto-electronic Chip-on-film(OE-COF) Packaging Technology "Single-mode Polyimide Optical Waveguide Films with Low Coefficients of Thermal Expansion" |
| Sub Title (in English) | |
| Keyword(1) | OE-COF packaging |
| Keyword(2) | Solder bump |
| Keyword(3) | OE film |
| Keyword(4) | Fluorinated polyimide |
| Keyword(5) | Single-mode |
| Keyword(6) | Coplanar waveguide(CPW) |
| 1st Author's Name | Mitsuo USUI |
| 1st Author's Affiliation | NTT Microsystem Integration Laboratories() |
| 2nd Author's Name | Hirooki HIRATA |
| 2nd Author's Affiliation | NTT Microsystem Integration Laboratories |
| 3rd Author's Name | Suzuko ISHIZAWA |
| 3rd Author's Affiliation | NTT Microsystem Integration Laboratories |
| 4th Author's Name | Nobutatsu KOSHOUBU |
| 4th Author's Affiliation | NTT photonics Laboratories |
| 5th Author's Name | Tsuyoshi HAYASHI |
| 5th Author's Affiliation | NTT Microsystem Integration Laboratories |
| 6th Author's Name | Shigehisa OHKI |
| 6th Author's Affiliation | NTT Microsystem Integration Laboratories |
| Date | 2004/4/16 |
| Paper # | R2004-1,CPM2004-1,OPE2004-1 |
| Volume (vol) | vol.104 |
| Number (no) | 28 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |