| Presentation | 2004/5/14 Thermal Deformation Analysis of PCB due to Thermal Stress by Using Holoraphic Pattern Measuring System Takanori NETSU, Kazuhiro KAMEYAMA, Toshiaki YANADA, Masanari TANIGUCHI, Tasuku TAKAGI, Noriyoshi CHUBACHI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | By using both FEMLAB and Thermal Graphic Measuring System (TGMS: Thermography), the thermal pattern was analyzed of printed circuit board deformed due to thermal stress. In addition, the deformation pattern was measured by the Holographic Pattern Measuring System (HPMS) which is composed of the system comprised of both techniques of holographic interferometry and graphic image processor. As the results, both thermal and deformation pattern were observed as a different pattern each other. The HPMS was well applied as a very effective tool to the measurement of the microscopic deformation pattern and to the 3-D graphic image analysis of PCB surface deformation due to thermal stress. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Printed circuit board / Thermal stress / Deformation analysis / Holography / Themography |
| Paper # | EMD2004-8 |
| Date of Issue |
| Conference Information | |
| Committee | EMD |
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| Conference Date | 2004/5/14(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Thermal Deformation Analysis of PCB due to Thermal Stress by Using Holoraphic Pattern Measuring System |
| Sub Title (in English) | |
| Keyword(1) | Printed circuit board |
| Keyword(2) | Thermal stress |
| Keyword(3) | Deformation analysis |
| Keyword(4) | Holography |
| Keyword(5) | Themography |
| 1st Author's Name | Takanori NETSU |
| 1st Author's Affiliation | Faculty of Science Technology, Tohoku Bunka Gakuen University() |
| 2nd Author's Name | Kazuhiro KAMEYAMA |
| 2nd Author's Affiliation | Faculty of Science Technology, Tohoku Bunka Gakuen University |
| 3rd Author's Name | Toshiaki YANADA |
| 3rd Author's Affiliation | Faculty of Science Technology, Tohoku Bunka Gakuen University |
| 4th Author's Name | Masanari TANIGUCHI |
| 4th Author's Affiliation | Faculty of Science Technology, Tohoku Bunka Gakuen University |
| 5th Author's Name | Tasuku TAKAGI |
| 5th Author's Affiliation | Faculty of Science Technology, Tohoku Bunka Gakuen University |
| 6th Author's Name | Noriyoshi CHUBACHI |
| 6th Author's Affiliation | Faculty of Engineering, Tohoku Gakuin University |
| Date | 2004/5/14 |
| Paper # | EMD2004-8 |
| Volume (vol) | vol.104 |
| Number (no) | 74 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |