Presentation 2004/5/14
HAST Test of PCB for TEL/LAN Connector
Kouji AITA, Seiichi ONODA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) When a newly developed TEL/LAN Rosette is used for the ISDN or Home Telephone System, considerably high DC voltage is happened to be applied to specific terminals of the rosette. In these situations, a kind of migration may be occurred, which spoils the insulation between strip lines on the circuit board connecting jack and clump terminals. In order to verify the reliability of the rosette, 200 hours of HAST test has been done for the circuit board under the application of DC voltage. As a result, very little changes in the insulation resistance were found. Considerations on the relation between resistance changes and the separation of the strip lines, as well as the observations of the color changes around the strip lines after the HAST stresses, show that migration does not occur and the rosette is sufficiently reliable.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Telephone / LAN / Rosette / Printed Circuit Board / Pressure Cooker / HAST / Migration
Paper # EMD2004-7
Date of Issue

Conference Information
Committee EMD
Conference Date 2004/5/14(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
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Topics (in English)
Vice Chair

Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) HAST Test of PCB for TEL/LAN Connector
Sub Title (in English)
Keyword(1) Telephone
Keyword(2) LAN
Keyword(3) Rosette
Keyword(4) Printed Circuit Board
Keyword(5) Pressure Cooker
Keyword(6) HAST
Keyword(7) Migration
1st Author's Name Kouji AITA
1st Author's Affiliation Watanabe Co.,Ltd.()
2nd Author's Name Seiichi ONODA
2nd Author's Affiliation Watanabe Co.,Ltd.
Date 2004/5/14
Paper # EMD2004-7
Volume (vol) vol.104
Number (no) 74
Page pp.pp.-
#Pages 6
Date of Issue