Presentation | 2004/5/14 Simulation of Deformation of Lead-Free Solder Alloys Using Viscoplastic Constitutive Model Ken-ichi OHGUCHI, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | An accurate FEM (Finite Element Method) analysis of lead-free solder joints should be conducted to estimate its thermal fatigue resistance. Almost all lead-free solder alloys show large time-dependent deformation so-called "viscoplastic deformation" such as strain rate effects, creep. Then, a FEM program must employ a viscoplastic constitutive model to describe the time-dependent deformation of lead-free solder alloys. This paper proposes a plasticity-creep separate type of inelastic constitutive model. To simply determine the material constants so-called a "plasticity-creep separation method" is also proposed. Using the proposed model and the determination method, the viscoplastic deformation of lead-free solder alloys can be simulated. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Electronic Package / Lead-Free Solder Alloys / Viscoplastic Constitutive Model / Creep / Cyclic Loading / Stress Relaxation |
Paper # | EMD2004-5 |
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Committee | EMD |
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Conference Date | 2004/5/14(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Simulation of Deformation of Lead-Free Solder Alloys Using Viscoplastic Constitutive Model |
Sub Title (in English) | |
Keyword(1) | Electronic Package |
Keyword(2) | Lead-Free Solder Alloys |
Keyword(3) | Viscoplastic Constitutive Model |
Keyword(4) | Creep |
Keyword(5) | Cyclic Loading |
Keyword(6) | Stress Relaxation |
1st Author's Name | Ken-ichi OHGUCHI |
1st Author's Affiliation | Faculty of Resource Science and Engineering, Akita University() |
Date | 2004/5/14 |
Paper # | EMD2004-5 |
Volume (vol) | vol.104 |
Number (no) | 74 |
Page | pp.pp.- |
#Pages | 8 |
Date of Issue |