Presentation 2004/5/14
Simulation of Deformation of Lead-Free Solder Alloys Using Viscoplastic Constitutive Model
Ken-ichi OHGUCHI,
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Abstract(in English) An accurate FEM (Finite Element Method) analysis of lead-free solder joints should be conducted to estimate its thermal fatigue resistance. Almost all lead-free solder alloys show large time-dependent deformation so-called "viscoplastic deformation" such as strain rate effects, creep. Then, a FEM program must employ a viscoplastic constitutive model to describe the time-dependent deformation of lead-free solder alloys. This paper proposes a plasticity-creep separate type of inelastic constitutive model. To simply determine the material constants so-called a "plasticity-creep separation method" is also proposed. Using the proposed model and the determination method, the viscoplastic deformation of lead-free solder alloys can be simulated.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Electronic Package / Lead-Free Solder Alloys / Viscoplastic Constitutive Model / Creep / Cyclic Loading / Stress Relaxation
Paper # EMD2004-5
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Conference Information
Committee EMD
Conference Date 2004/5/14(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Simulation of Deformation of Lead-Free Solder Alloys Using Viscoplastic Constitutive Model
Sub Title (in English)
Keyword(1) Electronic Package
Keyword(2) Lead-Free Solder Alloys
Keyword(3) Viscoplastic Constitutive Model
Keyword(4) Creep
Keyword(5) Cyclic Loading
Keyword(6) Stress Relaxation
1st Author's Name Ken-ichi OHGUCHI
1st Author's Affiliation Faculty of Resource Science and Engineering, Akita University()
Date 2004/5/14
Paper # EMD2004-5
Volume (vol) vol.104
Number (no) 74
Page pp.pp.-
#Pages 8
Date of Issue