Presentation 2004/8/19
Packaging and Performance of 40-Gb/s Transponder
Kiyohide SAKAI, Tatsuo HATTA, Akiyoshi SAWAI, Toru NAGASE, Minoru TAJIMA, Kazuo KUBO, Hiroshi ARIGA, Yorihira TAKANO, Shiho ZAIZEN, Minoru KAWANO, Morio HIGA, Kuniaki MOTOSHIMA,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) A compact 40-Gb/s optical transponder which serializes from and parallels to 16 channels of 2.5-Gb/s electrical signal has been developed for very short reach (VSR) applications. The use of 40-Gb/s coupled differential microstrip lines between an electroabsorption modulator (EAM) module and a multiplexer (MUX)IC and also between a photodiode (PD) module and a demultiplexer (DEMUX)IC provides small crosstalk to the receiver without any shield walls inside the package, which results in simple and low-cost packaging. The MUX-IC and DEMUX-IC encapsulation with a fluoropolymer gives no waveform change, and good moisture resistance under 85℃ and 85-% relative humidity over 1000 hours.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Transponders / Transceivers / Semiconductor device packaging / Coupled transmission lines
Paper # EMD2004-34,CPM2004-60,OPE2004-117,LQE2004-32
Date of Issue

Conference Information
Committee EMD
Conference Date 2004/8/19(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Packaging and Performance of 40-Gb/s Transponder
Sub Title (in English)
Keyword(1) Transponders
Keyword(2) Transceivers
Keyword(3) Semiconductor device packaging
Keyword(4) Coupled transmission lines
1st Author's Name Kiyohide SAKAI
1st Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation()
2nd Author's Name Tatsuo HATTA
2nd Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation
3rd Author's Name Akiyoshi SAWAI
3rd Author's Affiliation Advanced Technology R&D Center, Mitsubishi Electric Corporation
4th Author's Name Toru NAGASE
4th Author's Affiliation Kamakura Works, Mitsubishi Electric Corporation
5th Author's Name Minoru TAJIMA
5th Author's Affiliation Kamakura Works, Mitsubishi Electric Corporation
6th Author's Name Kazuo KUBO
6th Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation
7th Author's Name Hiroshi ARIGA
7th Author's Affiliation High Frequency & Optical Device Works, Mitsubishi Electric Corporation
8th Author's Name Yorihira TAKANO
8th Author's Affiliation Kamakura Works, Mitsubishi Electric Corporation
9th Author's Name Shiho ZAIZEN
9th Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation
10th Author's Name Minoru KAWANO
10th Author's Affiliation Kamakura Works, Mitsubishi Electric Corporation
11th Author's Name Morio HIGA
11th Author's Affiliation Ryoden Shonan Electronics Corporation
12th Author's Name Kuniaki MOTOSHIMA
12th Author's Affiliation Information Technology R&D Center, Mitsubishi Electric Corporation
Date 2004/8/19
Paper # EMD2004-34,CPM2004-60,OPE2004-117,LQE2004-32
Volume (vol) vol.104
Number (no) 263
Page pp.pp.-
#Pages 5
Date of Issue