Presentation 2003/8/22
Self-Aligned Flip-Chip Assembly of Monolithically Integrated Photo-Receiver with Optical Waveguides
Tomoyuki AKEYOSHI, Shinji AOYAMA, Takao ISHII, Atsushi ARATAKE, Masami TOKUMITSU,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We fabricated optical waveguides on photodiode chips. The chip monolithically integrated with optical interconnection were packaged by using flip-chip bonding by SnAu solder micro-bumps. An acceptable loss of less than 1 dB was achieved with passive alignment. This indicates our structure is promising for use in the construction of future ultra-high speed and cost-effective photo-receiver system.
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Keyword(in English) flip-chip / solder bump / optical waveguide / passive alignment / OEIC
Paper # EMD2003-46,CPM2003-91,OPE2003-128,LQE2003-47
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Committee EMD
Conference Date 2003/8/22(1days)
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Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Self-Aligned Flip-Chip Assembly of Monolithically Integrated Photo-Receiver with Optical Waveguides
Sub Title (in English)
Keyword(1) flip-chip
Keyword(2) solder bump
Keyword(3) optical waveguide
Keyword(4) passive alignment
Keyword(5) OEIC
1st Author's Name Tomoyuki AKEYOSHI
1st Author's Affiliation NTT Photonics Laboratories, NTT Corporation()
2nd Author's Name Shinji AOYAMA
2nd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
3rd Author's Name Takao ISHII
3rd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
4th Author's Name Atsushi ARATAKE
4th Author's Affiliation NTT Photonics Laboratories, NTT Corporation
5th Author's Name Masami TOKUMITSU
5th Author's Affiliation NTT Photonics Laboratories, NTT Corporation
Date 2003/8/22
Paper # EMD2003-46,CPM2003-91,OPE2003-128,LQE2003-47
Volume (vol) vol.103
Number (no) 268
Page pp.pp.-
#Pages 6
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