| Presentation | 2002/5/10 Study for Diffution of Lead-free Coil Soldering Ichizo SAKAMOTO, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A study of the relation between diffusion and solder material at a coil was studied. In this examination, we found that the diffusion is controlled with intermetallic compounds which Cupper of the solder forms. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Lead-free / Solder / Coil / Diffution |
| Paper # | EMD2002-6 |
| Date of Issue |
| Conference Information | |
| Committee | EMD |
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| Conference Date | 2002/5/10(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Study for Diffution of Lead-free Coil Soldering |
| Sub Title (in English) | |
| Keyword(1) | Lead-free |
| Keyword(2) | Solder |
| Keyword(3) | Coil |
| Keyword(4) | Diffution |
| 1st Author's Name | Ichizo SAKAMOTO |
| 1st Author's Affiliation | OMRON Corp. ECB COMPANY() |
| Date | 2002/5/10 |
| Paper # | EMD2002-6 |
| Volume (vol) | vol.102 |
| Number (no) | 61 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |