Presentation 2004-07-16
A Modeling Technique of Interconnects Using Numerical Laplace Transformation
Junji KAWATA, Yuichi TANJI, Yoshifumi NISHIO, Akio USHIDA,
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Abstract(in English) In this article, the admittance matrix of RLCG interconnects is modeled by partial fractions composed of the exact poles of the admittance matrix and the corresponding residues. The exact poles can be obtained by applying the Leverrier-Faddeeva algorithm. In this article, a new method for calculating the residues is proposed. The residues can be calculated by using numerical Laplace transformation and the least squares method so that the impulse or pulse response of the partial fraction is matched with the one of each element of the exact admittance matrix in the time-domain. From the partial fraction representation, asymptotic equivalent circuit models can be synthesized.
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Keyword(in English) RLCG interconnects / Leverrier-Faddeeva algorithm / numerical Laplace transformation / least squares method / asymptotic equivalent circuits
Paper # NLP2004-29
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Committee NLP
Conference Date 2004/7/9(1days)
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Registration To Nonlinear Problems (NLP)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Modeling Technique of Interconnects Using Numerical Laplace Transformation
Sub Title (in English)
Keyword(1) RLCG interconnects
Keyword(2) Leverrier-Faddeeva algorithm
Keyword(3) numerical Laplace transformation
Keyword(4) least squares method
Keyword(5) asymptotic equivalent circuits
1st Author's Name Junji KAWATA
1st Author's Affiliation Faculty of Engineering, Tokushima Bunri University()
2nd Author's Name Yuichi TANJI
2nd Author's Affiliation Faculty of Engineering, Kagawa University
3rd Author's Name Yoshifumi NISHIO
3rd Author's Affiliation Faculty of Engineering, Tokushima University
4th Author's Name Akio USHIDA
4th Author's Affiliation Faculty of Engineering, Tokushima Bunri University
Date 2004-07-16
Paper # NLP2004-29
Volume (vol) vol.104
Number (no) 197
Page pp.pp.-
#Pages 6
Date of Issue