Presentation 2004/9/2
Study of Electrical Properties of Organopolysilane Thin Films
Koji ISHII, Tomoki TAKAMOTO, Hidetaka OHTA, Atsushi YAMAZAKI, Takashi YASUDA, Shoji FURUKAWA,
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Abstract(in English) We have studied the molecular structure and packing of various silicon-based polymers, i.e., organopolysilanes. Poly(di-methyl silane), the most fundamental organopolysilane, is not solved in organic solvent at room temperature. Therefore, we have proposed the vacuum evaporation method in order to obtain poly(di-methyl silane) thin films. In this paper, polysilane thin films are prepared, and electrical properties of the films obtained are examined.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Organopolysilane / Poly(di-methyl silane) / Electrical Properties
Paper # ED2004-109,OME2004-43
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Committee OME
Conference Date 2004/9/2(1days)
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Registration To Organic Material Electronics (OME)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Study of Electrical Properties of Organopolysilane Thin Films
Sub Title (in English)
Keyword(1) Organopolysilane
Keyword(2) Poly(di-methyl silane)
Keyword(3) Electrical Properties
1st Author's Name Koji ISHII
1st Author's Affiliation Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology()
2nd Author's Name Tomoki TAKAMOTO
2nd Author's Affiliation Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology
3rd Author's Name Hidetaka OHTA
3rd Author's Affiliation Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology
4th Author's Name Atsushi YAMAZAKI
4th Author's Affiliation Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology
5th Author's Name Takashi YASUDA
5th Author's Affiliation Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology
6th Author's Name Shoji FURUKAWA
6th Author's Affiliation Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology
Date 2004/9/2
Paper # ED2004-109,OME2004-43
Volume (vol) vol.104
Number (no) 285
Page pp.pp.-
#Pages 5
Date of Issue