Presentation 2004/9/21
Direct Measurement of Stress Dependent Inversion Layer Mobility Using a Novel Test Structure
Takeshi OKAGAKI, Motoaki TANIZAWA, Tetsuya UCHIDA, Tatsuya KUNIKIYO, Ken'ichiro SONODA, Motoshige IGARASHI, Kiyoshi ISHIKAWA, Norihiko KOTANI,
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Abstract(in English) We propose a novel mobility measurement method which can be applied to industrial sized MOSFETs. The mobility variation caused by Shallow Trench Isolation(STI) stress is evaluated directly. Extracted piezoresistance coefficients in the inversion layer are close to their counterparts in bulk silicon. The stress effect model like that incorporated into BSIM4.3.0 is verified to adequately predict the behavior. Additionally, we have observed for the first time that the inversion layer mobility in <100> channel MOSFETs is less sensitive to the STI stress than that in <110> channel MOSFETs. Therefore, CMOS devices with layouts along the <100> direction is expected to have high performance with reduced source of design complication.
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Keyword(in English) mobility / piezoresistance coefficients / CBCM method / 3D Simulator
Paper # VLD2004-43,SDM2004-167
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Committee VLD
Conference Date 2004/9/21(1days)
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Registration To VLSI Design Technologies (VLD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Direct Measurement of Stress Dependent Inversion Layer Mobility Using a Novel Test Structure
Sub Title (in English)
Keyword(1) mobility
Keyword(2) piezoresistance coefficients
Keyword(3) CBCM method
Keyword(4) 3D Simulator
1st Author's Name Takeshi OKAGAKI
1st Author's Affiliation Renesas Technology Corp.()
2nd Author's Name Motoaki TANIZAWA
2nd Author's Affiliation Renesas Technology Corp.
3rd Author's Name Tetsuya UCHIDA
3rd Author's Affiliation Renesas Technology Corp.
4th Author's Name Tatsuya KUNIKIYO
4th Author's Affiliation Renesas Technology Corp.
5th Author's Name Ken'ichiro SONODA
5th Author's Affiliation Renesas Technology Corp.
6th Author's Name Motoshige IGARASHI
6th Author's Affiliation Renesas Technology Corp.
7th Author's Name Kiyoshi ISHIKAWA
7th Author's Affiliation Renesas Technology Corp.
8th Author's Name Norihiko KOTANI
8th Author's Affiliation Faculty of Infrastructural Technologies, Hiroshima International University
Date 2004/9/21
Paper # VLD2004-43,SDM2004-167
Volume (vol) vol.104
Number (no) 322
Page pp.pp.-
#Pages 6
Date of Issue