| Presentation | 2003/5/21 1.27Gb/s/pin, 3mW/pin Wireless Superconnect (WSC) Interface Scheme Kouichi KANDA, Danardono Dwi ANTONO, Koichi ISHIDA, Hiroshi KAWAGUCHI, Tadahiro KURODA, Takayasu SAKURAI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A low-power high-speed chip-to-chip interface scheme is described having a density of 625pins/mm^2. The interface utilizes capacitively coupled contactless minipads, return-to-V_ |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | I-O / high bandwidth / wireless connection / low power / high-density pad |
| Paper # | ICD2003-16 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2003/5/21(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 1.27Gb/s/pin, 3mW/pin Wireless Superconnect (WSC) Interface Scheme |
| Sub Title (in English) | |
| Keyword(1) | I-O |
| Keyword(2) | high bandwidth |
| Keyword(3) | wireless connection |
| Keyword(4) | low power |
| Keyword(5) | high-density pad |
| 1st Author's Name | Kouichi KANDA |
| 1st Author's Affiliation | Institute of Industrial Science, University of Tokyo() |
| 2nd Author's Name | Danardono Dwi ANTONO |
| 2nd Author's Affiliation | Institute of Industrial Science, University of Tokyo |
| 3rd Author's Name | Koichi ISHIDA |
| 3rd Author's Affiliation | Institute of Industrial Science, University of Tokyo |
| 4th Author's Name | Hiroshi KAWAGUCHI |
| 4th Author's Affiliation | Institute of Industrial Science, University of Tokyo |
| 5th Author's Name | Tadahiro KURODA |
| 5th Author's Affiliation | Faculty of Science and Technology, Keio University |
| 6th Author's Name | Takayasu SAKURAI |
| 6th Author's Affiliation | Institute of Industrial Science, University of Tokyo |
| Date | 2003/5/21 |
| Paper # | ICD2003-16 |
| Volume (vol) | vol.103 |
| Number (no) | 88 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |