Presentation 2004/1/30
Transmission Line Power Supply for Over GHz Data Transmission
Keisuke SAITO, Yutaka AKIYAMA, Chihiro UEDA, Tamotsu USAMI, Kanji OTSUKA, Tadatomo SUGA,
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Abstract(in English) As the inter-chip data transmission rate keeps increasing, power supply has become a large concern. The resonance, which occurs inside power-ground planes of printed circuit boards is the principle factor of EMI. The inductive component of decoupling capacitors cannot be ignored any longer, as they will cause problems at high frequencies. With regard to the issues mentioned above, we have done researches on power supply methods by using transmission line structured power supply lines instead of the conventional method using power-ground plane and decoupling capacitors. From the results of simulation, discussions on voltage droop (voltage drop) are also done.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) High-Speed Data Transmission / Ground Bounce
Paper # CPM2003-184,ICD2003-223
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Conference Date 2004/1/30(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Transmission Line Power Supply for Over GHz Data Transmission
Sub Title (in English)
Keyword(1) High-Speed Data Transmission
Keyword(2) Ground Bounce
1st Author's Name Keisuke SAITO
1st Author's Affiliation RCAST, University of Tokyo()
2nd Author's Name Yutaka AKIYAMA
2nd Author's Affiliation Faculty of Informatics, Meisei University
3rd Author's Name Chihiro UEDA
3rd Author's Affiliation Faculty of Informatics, Meisei University
4th Author's Name Tamotsu USAMI
4th Author's Affiliation RCAST, University of Tokyo
5th Author's Name Kanji OTSUKA
5th Author's Affiliation Faculty of Informatics, Meisei University
6th Author's Name Tadatomo SUGA
6th Author's Affiliation RCAST, University of Tokyo
Date 2004/1/30
Paper # CPM2003-184,ICD2003-223
Volume (vol) vol.103
Number (no) 648
Page pp.pp.-
#Pages 5
Date of Issue