| Presentation | 2004/1/30 The Technology of System in Package for High-speed Transmission Akira MIYOTA, Nobukatsu SAITO, Atsushi KIKUCHI, Yoshiyuki YONEDA, Mitsutaka SATO, Makoto IIJIMA, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A High-end System-in-Package (HSiP) technology was developed, which enables connection between chips with multiple bits using a thin film interposer with fine pattern technique. Using the fine pattern wiring process technology in wafer state, the thin film interposer adopted low a polymide technology and Si carier separation technology, and realized fine pattern of laminating structure (design rule line/space= 15/20 um and size 20mm×40mm×35um). Moreover, High-end System-in-Package, which accommodated a high-speed I/O evaluation TEG chip was made as a test vehicle, and the transmission rate of 3.125Gbps was confirmed between chips in the package with transmission characteristics. In the high-end application with high-speed transmission, the capability of System-in-Package has been ensured with the high-end technology using this thin film interposer. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | High-end SiP / Thin film interposer / File pattern process / 3.125Gbps / High-speed serial signal transmission |
| Paper # | CPM2003-183,ICD2003-222 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2004/1/30(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | The Technology of System in Package for High-speed Transmission |
| Sub Title (in English) | |
| Keyword(1) | High-end SiP |
| Keyword(2) | Thin film interposer |
| Keyword(3) | File pattern process |
| Keyword(4) | 3.125Gbps |
| Keyword(5) | High-speed serial signal transmission |
| 1st Author's Name | Akira MIYOTA |
| 1st Author's Affiliation | Fujitsu Limited, Akiruno technology center() |
| 2nd Author's Name | Nobukatsu SAITO |
| 2nd Author's Affiliation | Fujitsu Limited, Akiruno technology center |
| 3rd Author's Name | Atsushi KIKUCHI |
| 3rd Author's Affiliation | Fujitsu Limited, Akiruno technology center |
| 4th Author's Name | Yoshiyuki YONEDA |
| 4th Author's Affiliation | Fujitsu Limited, Akiruno technology center |
| 5th Author's Name | Mitsutaka SATO |
| 5th Author's Affiliation | Fujitsu Limited, Akiruno technology center |
| 6th Author's Name | Makoto IIJIMA |
| 6th Author's Affiliation | Fujitsu Limited, Akiruno technology center |
| Date | 2004/1/30 |
| Paper # | CPM2003-183,ICD2003-222 |
| Volume (vol) | vol.103 |
| Number (no) | 648 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |