Presentation 2004/1/30
IC-Package Manufacturing System Based on Object Oriented Technology
Hiroaki SAMIZU, Hiroaki NOSE, Takashi NISHIDA,
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Abstract(in English) A new IC-Package manufacturing system based on the object oriented technology with Java language has been developed for providing the users with higher flexibilities than legacy systems'. The hierarchically constructed classes enable the users to view a system as a set of objects, each of which represents a manufacturing machine, a measurement equipment, etc., cooperating each other and encapsulate detailed structures and behaviors of those components. The intuitive graphical user interface helps a system designer develop and modify a manufacturing system application quickly.
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Keyword(in English) manufacturing-system / Object oriented / Java
Paper # CPM2003-181,ICD2003-220
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Conference Date 2004/1/30(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) IC-Package Manufacturing System Based on Object Oriented Technology
Sub Title (in English)
Keyword(1) manufacturing-system
Keyword(2) Object oriented
Keyword(3) Java
1st Author's Name Hiroaki SAMIZU
1st Author's Affiliation Core Technology Research Laboratory. SHINKO ELECTRIC INDUSTRIES CO., LTD()
2nd Author's Name Hiroaki NOSE
2nd Author's Affiliation Information Technology Research Institute of Nagano Prefecture
3rd Author's Name Takashi NISHIDA
3rd Author's Affiliation Information Technology Research Institute of Nagano Prefecture
Date 2004/1/30
Paper # CPM2003-181,ICD2003-220
Volume (vol) vol.103
Number (no) 648
Page pp.pp.-
#Pages 6
Date of Issue