| Presentation | 2004/1/30 Examination of highly reliable Pb-free solder Yoshitaka TOYODA, Takeshi TASHIMA, Masazumi AMAGAI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Sn-Ag-Cu alloys are leading candidates for lead free solders. However, Sn-Ag-Cu alloys were not satisfied to meet severe customer requirements. At first, optimum silver wt% was investigated to get the balance of drop, thermal cycling, bend test performance and solder internal voids. Addition elements were subsequently studied while observing reliability performance. Based on the results of board level reliability tests, new lead free solder has been developed. This paper presents the optimum Ag and addition elements in Sn-Ag based solder alloys. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Lead free solder / Reliability / Drop test / Thermal cycling test / Bend test / Void |
| Paper # | CPM2003-179,ICD2003-218 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2004/1/30(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Examination of highly reliable Pb-free solder |
| Sub Title (in English) | |
| Keyword(1) | Lead free solder |
| Keyword(2) | Reliability |
| Keyword(3) | Drop test |
| Keyword(4) | Thermal cycling test |
| Keyword(5) | Bend test |
| Keyword(6) | Void |
| 1st Author's Name | Yoshitaka TOYODA |
| 1st Author's Affiliation | R&D Technicalcenter, Senju Metal Industry Co.,LTD() |
| 2nd Author's Name | Takeshi TASHIMA |
| 2nd Author's Affiliation | R&D Technicalcenter, Senju Metal Industry Co.,LTD |
| 3rd Author's Name | Masazumi AMAGAI |
| 3rd Author's Affiliation | Modeling & Characterization, Tsukuba Technology Center, Texas Instruments Japan Limited |
| Date | 2004/1/30 |
| Paper # | CPM2003-179,ICD2003-218 |
| Volume (vol) | vol.103 |
| Number (no) | 648 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |