| Presentation | 2004/1/30 Development of the Chip on Chip structure Package Utilizing Ultrasonic Flip-Chip Bonding Toshihiro IWASAKI, Keiichiro WAKAMIYA, Yasumichi HATANAKA, Yoshihiro TOMITA, Michitaka KIMURA, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The ultrasonic flip-chip bonding technology (US-FCB) using Au bump is one of the best solution for System-in-a-Package (SiP) of Chip On Chip (COC) structure from the standpoints of reliability of interconnection and productivity. The technology performs the metallurgical bonding between the gold bumps and the aluminum pads in solid-phase. In this paper, the results of the experiments on the COC structure, such as bondability and electrical characteristics, are reported. This technology will lead the creation of various SiP products that meet market demands. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Chip On Chip structure / Ultrasonic Flip-Chip Bonding / System in a Package / Signal delay |
| Paper # | CPM2003-178,ICD2003-217 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2004/1/30(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of the Chip on Chip structure Package Utilizing Ultrasonic Flip-Chip Bonding |
| Sub Title (in English) | |
| Keyword(1) | Chip On Chip structure |
| Keyword(2) | Ultrasonic Flip-Chip Bonding |
| Keyword(3) | System in a Package |
| Keyword(4) | Signal delay |
| 1st Author's Name | Toshihiro IWASAKI |
| 1st Author's Affiliation | Packaging Technology Development Dept., Renesas Technology Corporation() |
| 2nd Author's Name | Keiichiro WAKAMIYA |
| 2nd Author's Affiliation | Packaging Technology Development Dept., Renesas Technology Corporation |
| 3rd Author's Name | Yasumichi HATANAKA |
| 3rd Author's Affiliation | Advanced Technology R&D Center,Mitsubishi Electric Corporation |
| 4th Author's Name | Yoshihiro TOMITA |
| 4th Author's Affiliation | Packaging Technology Development Dept., Renesas Technology Corporation |
| 5th Author's Name | Michitaka KIMURA |
| 5th Author's Affiliation | Packaging Technology Development Dept., Renesas Technology Corporation |
| Date | 2004/1/30 |
| Paper # | CPM2003-178,ICD2003-217 |
| Volume (vol) | vol.103 |
| Number (no) | 648 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |