| Presentation | 2004/1/30 Semiconductor package thermal analysis : Thermal analysis of the hotspot Masanobu NAESHIRO, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Recently, application of thermal management for electronic devices is becoming a big factor on electronic products while power dissipation is going up as the increase of 1C access speed. Hence, package level and system level thermal measurement, modeling techniques were developed to study comprehensive thermal resistance in our device applications. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Thermal test die / Thermal resistance / Thermal measurement |
| Paper # | CPM2003-176,ICD2003-215 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2004/1/30(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Semiconductor package thermal analysis : Thermal analysis of the hotspot |
| Sub Title (in English) | |
| Keyword(1) | Thermal test die |
| Keyword(2) | Thermal resistance |
| Keyword(3) | Thermal measurement |
| 1st Author's Name | Masanobu NAESHIRO |
| 1st Author's Affiliation | Modeling & Characterization, Texas Instruments Japan Limited() |
| Date | 2004/1/30 |
| Paper # | CPM2003-176,ICD2003-215 |
| Volume (vol) | vol.103 |
| Number (no) | 648 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |