| Presentation | 2003/1/24 Packaging Technology for High Performance UNIX Server Masateru Koide, Jie Wei, Akihiko Fujisaki, Yoshinori Uzuka, Masahiro Suzuki, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Fujitsu has developed new high performance organic build-up substrate modules, MCMs and SCMs, for high performance servers. Size of the MCM is 150mm wide, 120mm long and 61 mm in height on which three bare chips and ten SRAM packages are mounted. The MCM substrate uses a superior build up substrate technology which makes possible to form five thin-film layers on each side of a four-layer core (5-4-5), and to connect a surface layer to a third layer straightly with a filled via. A LSl pad pitch is 220 microns. The MCM is connected to a motherboard with two LGA connectors having 1,100 LGA pads for each. In addition, the module resolves high heat dissipation from LSIs. Size of the SCM is 47.5 mm wide, 47.5 mm long and 53 mm in thickness. There are 2,208 BGA pads. Mounting a LSl as large as 18×18mm is possible on the module by using the packaging technology. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | MCM-L-D / Flip Chip / Packaging Technology |
| Paper # | CPM2002-164,ICD2002-209 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2003/1/24(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Packaging Technology for High Performance UNIX Server |
| Sub Title (in English) | |
| Keyword(1) | MCM-L-D |
| Keyword(2) | Flip Chip |
| Keyword(3) | Packaging Technology |
| 1st Author's Name | Masateru Koide |
| 1st Author's Affiliation | FUJITSU LIMITED() |
| 2nd Author's Name | Jie Wei |
| 2nd Author's Affiliation | FUJITSU LIMITED |
| 3rd Author's Name | Akihiko Fujisaki |
| 3rd Author's Affiliation | FUJITSU LIMITED |
| 4th Author's Name | Yoshinori Uzuka |
| 4th Author's Affiliation | FUJITSU LIMITED |
| 5th Author's Name | Masahiro Suzuki |
| 5th Author's Affiliation | FUJITSU LIMITED |
| Date | 2003/1/24 |
| Paper # | CPM2002-164,ICD2002-209 |
| Volume (vol) | vol.102 |
| Number (no) | 623 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |