| Presentation | 2003/1/23 Bare Die Testing Technology to Realize Ultra High Density Three Dimensional LSI Stacking Module Michinobu TANIOKA, Yuji SHIRAI, Kazumi KOJIMA, Kenji TAKAHASHI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The ultra pitch probing technology that aims at the bare die testing is indispensable to realize the mass production of three-dimensional LSl module. The ultra fine pitch probe and the high accuracy prober were developed to achieve this technology. The material and structure of the probe tip were determined according to the contact material. The high accuracy prober achieved the probing accuracy of less than l .0μm that was half the accuracy of the commercial available prober by new mechanical structure. Consequently, The ultra pitch probing technology to 20μm pitch electrode was established on constant probing conditions using the new probe and prober. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Three Dimensional Packaging / Known Good Die / Wafer Testing / Electrical Contact / Micro Probe / Wafer Prober |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2003/1/23(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Bare Die Testing Technology to Realize Ultra High Density Three Dimensional LSI Stacking Module |
| Sub Title (in English) | |
| Keyword(1) | Three Dimensional Packaging |
| Keyword(2) | Known Good Die |
| Keyword(3) | Wafer Testing |
| Keyword(4) | Electrical Contact |
| Keyword(5) | Micro Probe |
| Keyword(6) | Wafer Prober |
| 1st Author's Name | Michinobu TANIOKA |
| 1st Author's Affiliation | Association of Super-Advanced Electronics Technologies (ASET)() |
| 2nd Author's Name | Yuji SHIRAI |
| 2nd Author's Affiliation | Association of Super-Advanced Electronics Technologies (ASET) |
| 3rd Author's Name | Kazumi KOJIMA |
| 3rd Author's Affiliation | Association of Super-Advanced Electronics Technologies (ASET) |
| 4th Author's Name | Kenji TAKAHASHI |
| 4th Author's Affiliation | Association of Super-Advanced Electronics Technologies (ASET) |
| Date | 2003/1/23 |
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| Volume (vol) | vol.102 |
| Number (no) | 622 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |