Presentation 2004/6/23
Study of Abnormal Oxidation of Ni-Germanosilicide by High Temperature Post-Silicidation Annealing(Session A3 Si Materails and Process)(2004 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
Bin-Feng Huang, Soon-Young Oh, Jang-Gu Yun, Yong-Jin Kim, Hee-Hwan Ji, Yong-Goo Kim, Han-Seob Cha, Sang-Bum Heo, Jeong-Gun Lee, Yoo-Jeong Cho, Yeong-Cheol Kim, Hi-Deok Lee,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) The characteristics of Ni-Germanosilicide were studied by sheet resistance, Field Emission Scanning Electron Microscope (FE-SEM), X-Ray Diffraction (XRD) and X-ray Photoelectron Spectroscopy (XPS). It was found that Ni-Germanosilicide formed using pure-Ni has a very poor thermal stability. After the post-silicidation annealing, severe agglomeration and Ge segregation were occurred and almost all the silicide layer was replaced by oxide and remained Ge compound. That is, there happened abnormal oxidation of Ni-Germanosilicide. To prevent the unintended oxidation or to improve the Ni-Germanosilicide thermal stability, various kinds of triple-layer metal structures were applied in this work and Ti/Ni/TiN triple-layer was found to be very effective structure to prevent the unwanted abnormal oxidation and hence to improve the thermal stability of the Ni-Germanosilicide.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Salicide / Silicon Germanium (SiGe) / silicide / abnormal oxidation / triple-layer metal
Paper # ED2004-65,SDM2004-77
Date of Issue

Conference Information
Committee SDM
Conference Date 2004/6/23(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Study of Abnormal Oxidation of Ni-Germanosilicide by High Temperature Post-Silicidation Annealing(Session A3 Si Materails and Process)(2004 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices (AWAD 2004))
Sub Title (in English)
Keyword(1) Salicide
Keyword(2) Silicon Germanium (SiGe)
Keyword(3) silicide
Keyword(4) abnormal oxidation
Keyword(5) triple-layer metal
1st Author's Name Bin-Feng Huang
1st Author's Affiliation Dept. of Electronics Engineering, Chungnam National University()
2nd Author's Name Soon-Young Oh
2nd Author's Affiliation Dept. of Electronics Engineering, Chungnam National University
3rd Author's Name Jang-Gu Yun
3rd Author's Affiliation Dept. of Electronics Engineering, Chungnam National University
4th Author's Name Yong-Jin Kim
4th Author's Affiliation Dept. of Electronics Engineering, Chungnam National University
5th Author's Name Hee-Hwan Ji
5th Author's Affiliation Dept. of Electronics Engineering, Chungnam National University
6th Author's Name Yong-Goo Kim
6th Author's Affiliation Dept. of Electronics Engineering, Chungnam National University
7th Author's Name Han-Seob Cha
7th Author's Affiliation System IC R&D Division, Hynix Semiconductor Inc.
8th Author's Name Sang-Bum Heo
8th Author's Affiliation System IC R&D Division, Hynix Semiconductor Inc.
9th Author's Name Jeong-Gun Lee
9th Author's Affiliation System IC R&D Division, Hynix Semiconductor Inc.
10th Author's Name Yoo-Jeong Cho
10th Author's Affiliation Dept. of Materials Engineering, Korea University of Technology and Education
11th Author's Name Yeong-Cheol Kim
11th Author's Affiliation Dept. of Materials Engineering, Korea University of Technology and Education
12th Author's Name Hi-Deok Lee
12th Author's Affiliation Dept. of Electronics Engineering, Chungnam National University
Date 2004/6/23
Paper # ED2004-65,SDM2004-77
Volume (vol) vol.104
Number (no) 155
Page pp.pp.-
#Pages 4
Date of Issue