Presentation | 2004/1/26 Novel Self-Assembled Ultra-Low-k Porous Silica Films with High Mechanical Strength for 45 nm BEOL Technology Y. Oku, K. Yamada, T. Goto, Y. Seino, A. Ishikawa, T. Ogata, K. Kohmura, N. Fujii, N. Hata, R. Ichikawa, T. Yoshino, C. Negoro, A. Nakano, Y. Sonoda, S. Takada, H. Miyoshi, S. Oike, H. Tanaka, H. Matsuo, K. Kinoshita, T. Kikkawa, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Novel ultra-low-k porous silica films were developed by use of a self-assembly technology. The mechanical properties of the porous silica films could be reinforced independently of the dielectric constant by introducing tetramethyl-cyclo-tetra-siloxane (TMCTS) treatment. High modulus porous silica films with the elastic modulus of 8 GPa and dielectric constant of 2 can be achieved simultaneously. Ultra-low-k/Cu damascene with sufficient mechanical strength was demonstrated for 45 nm BEOL technology. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | self-assembly / surfactant / ultra low-k / porous silica / TMCTS / Low-k/Cu damascene |
Paper # | SDM2003-229 |
Date of Issue |
Conference Information | |
Committee | SDM |
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Conference Date | 2004/1/26(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Silicon Device and Materials (SDM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Novel Self-Assembled Ultra-Low-k Porous Silica Films with High Mechanical Strength for 45 nm BEOL Technology |
Sub Title (in English) | |
Keyword(1) | self-assembly |
Keyword(2) | surfactant |
Keyword(3) | ultra low-k |
Keyword(4) | porous silica |
Keyword(5) | TMCTS |
Keyword(6) | Low-k/Cu damascene |
1st Author's Name | Y. Oku |
1st Author's Affiliation | MIRAI-ASET() |
2nd Author's Name | K. Yamada |
2nd Author's Affiliation | MIRAI-ASET |
3rd Author's Name | T. Goto |
3rd Author's Affiliation | MIRAI-ASET |
4th Author's Name | Y. Seino |
4th Author's Affiliation | MIRAI-ASRC-AIST |
5th Author's Name | A. Ishikawa |
5th Author's Affiliation | MIRAI-ASET |
6th Author's Name | T. Ogata |
6th Author's Affiliation | MIRAI-ASET |
7th Author's Name | K. Kohmura |
7th Author's Affiliation | MIRAI-ASET |
8th Author's Name | N. Fujii |
8th Author's Affiliation | MIRAI-ASET |
9th Author's Name | N. Hata |
9th Author's Affiliation | MIRAI-ASRC-AIST |
10th Author's Name | R. Ichikawa |
10th Author's Affiliation | MIRAI-ASRC-AIST |
11th Author's Name | T. Yoshino |
11th Author's Affiliation | MIRAI-ASRC-AIST |
12th Author's Name | C. Negoro |
12th Author's Affiliation | MIRAI-ASRC-AIST |
13th Author's Name | A. Nakano |
13th Author's Affiliation | MIRAI-ASET |
14th Author's Name | Y. Sonoda |
14th Author's Affiliation | MIRAI-ASET |
15th Author's Name | S. Takada |
15th Author's Affiliation | MIRAI-ASRC-AIST |
16th Author's Name | H. Miyoshi |
16th Author's Affiliation | MIRAI-ASET |
17th Author's Name | S. Oike |
17th Author's Affiliation | MIRAI-ASET |
18th Author's Name | H. Tanaka |
18th Author's Affiliation | MIRAI-ASET |
19th Author's Name | H. Matsuo |
19th Author's Affiliation | MIRAI-ASET |
20th Author's Name | K. Kinoshita |
20th Author's Affiliation | MIRAI-ASET |
21th Author's Name | T. Kikkawa |
21th Author's Affiliation | MIRAI-ASRC-AIST:RCNS, Hiroshima University |
Date | 2004/1/26 |
Paper # | SDM2003-229 |
Volume (vol) | vol.103 |
Number (no) | 638 |
Page | pp.pp.- |
#Pages | 5 |
Date of Issue |