Presentation 2004/1/26
Novel Self-Assembled Ultra-Low-k Porous Silica Films with High Mechanical Strength for 45 nm BEOL Technology
Y. Oku, K. Yamada, T. Goto, Y. Seino, A. Ishikawa, T. Ogata, K. Kohmura, N. Fujii, N. Hata, R. Ichikawa, T. Yoshino, C. Negoro, A. Nakano, Y. Sonoda, S. Takada, H. Miyoshi, S. Oike, H. Tanaka, H. Matsuo, K. Kinoshita, T. Kikkawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Novel ultra-low-k porous silica films were developed by use of a self-assembly technology. The mechanical properties of the porous silica films could be reinforced independently of the dielectric constant by introducing tetramethyl-cyclo-tetra-siloxane (TMCTS) treatment. High modulus porous silica films with the elastic modulus of 8 GPa and dielectric constant of 2 can be achieved simultaneously. Ultra-low-k/Cu damascene with sufficient mechanical strength was demonstrated for 45 nm BEOL technology.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) self-assembly / surfactant / ultra low-k / porous silica / TMCTS / Low-k/Cu damascene
Paper # SDM2003-229
Date of Issue

Conference Information
Committee SDM
Conference Date 2004/1/26(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Novel Self-Assembled Ultra-Low-k Porous Silica Films with High Mechanical Strength for 45 nm BEOL Technology
Sub Title (in English)
Keyword(1) self-assembly
Keyword(2) surfactant
Keyword(3) ultra low-k
Keyword(4) porous silica
Keyword(5) TMCTS
Keyword(6) Low-k/Cu damascene
1st Author's Name Y. Oku
1st Author's Affiliation MIRAI-ASET()
2nd Author's Name K. Yamada
2nd Author's Affiliation MIRAI-ASET
3rd Author's Name T. Goto
3rd Author's Affiliation MIRAI-ASET
4th Author's Name Y. Seino
4th Author's Affiliation MIRAI-ASRC-AIST
5th Author's Name A. Ishikawa
5th Author's Affiliation MIRAI-ASET
6th Author's Name T. Ogata
6th Author's Affiliation MIRAI-ASET
7th Author's Name K. Kohmura
7th Author's Affiliation MIRAI-ASET
8th Author's Name N. Fujii
8th Author's Affiliation MIRAI-ASET
9th Author's Name N. Hata
9th Author's Affiliation MIRAI-ASRC-AIST
10th Author's Name R. Ichikawa
10th Author's Affiliation MIRAI-ASRC-AIST
11th Author's Name T. Yoshino
11th Author's Affiliation MIRAI-ASRC-AIST
12th Author's Name C. Negoro
12th Author's Affiliation MIRAI-ASRC-AIST
13th Author's Name A. Nakano
13th Author's Affiliation MIRAI-ASET
14th Author's Name Y. Sonoda
14th Author's Affiliation MIRAI-ASET
15th Author's Name S. Takada
15th Author's Affiliation MIRAI-ASRC-AIST
16th Author's Name H. Miyoshi
16th Author's Affiliation MIRAI-ASET
17th Author's Name S. Oike
17th Author's Affiliation MIRAI-ASET
18th Author's Name H. Tanaka
18th Author's Affiliation MIRAI-ASET
19th Author's Name H. Matsuo
19th Author's Affiliation MIRAI-ASET
20th Author's Name K. Kinoshita
20th Author's Affiliation MIRAI-ASET
21th Author's Name T. Kikkawa
21th Author's Affiliation MIRAI-ASRC-AIST:RCNS, Hiroshima University
Date 2004/1/26
Paper # SDM2003-229
Volume (vol) vol.103
Number (no) 638
Page pp.pp.-
#Pages 5
Date of Issue