Presentation	2003/1/31 IC Metallization using Supercritical Fluids Eiichi KONDOH,
PDF Download Page	PDF download Page Link
Abstract(in Japanese)	(See Japanese page)
Abstract(in English)	Metal thin films for ULSI metallization are currently deposited either from vapor (PVD/CVD) or liquid (e. g. ECD). This paper reports on the use of a supercritical CO_2 (scCO_2) fluid as a new medium for depositing Cu thin films. Deposition from Cu^ (hfac)_2 (hfac=hexafluoroacetylacetonate) was carried out at pressures of 10-15 Mpa and temperatures of 180-400℃. Preferential growth on conductive substrates was observed. The lowest deposition temperature was 180℃, which is about 100℃ lower than that reported for Cu CVD from Cu^ (hfac)_2. X-ray photoelectron spectra of the films showed pronounced metallic Cu peaks and trace level of impurity elements. It was found that the films were (lll)-oriented. Copper filling into deep-sub-half-micron high-aspect-ratio features was demonstrated. A critical role of solvent capability of supercritical C0_2 on the film quality was discussed with comparative depositions using supercritical Ar.
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)	Supercrical fluids / Carbon dioxide / Copper / Interconnects
Paper #	SDM2002-235
Date of Issue

Conference Information
Committee	SDM
Conference Date	2003/1/31(1days)
Place (in Japanese)	(See Japanese page)
Place (in English)
Topics (in Japanese)	(See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To	Silicon Device and Materials (SDM)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	IC Metallization using Supercritical Fluids
Sub Title (in English)
Keyword(1)	Supercrical fluids
Keyword(2)	Carbon dioxide
Keyword(3)	Copper
Keyword(4)	Interconnects
1st Author's Name	Eiichi KONDOH
1st Author's Affiliation	Faculty of Engineering, University of Yamanashi()
Date	2003/1/31
Paper #	SDM2002-235
Volume (vol)	vol.102
Number (no)	637
Page	pp.pp.-
#Pages	5
Date of Issue