Presentation 2003/1/31
Al CVD Technology using MPA (methylpyrrolidine alane)
Manabu Sakamoto, Kazuya Masu, Eri Sugimoto, Jin Il Lee, Masanobu Hatanaka, Yoshikazu Takahashi, Michio Ishikawa, Yuji Furumura,
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Abstract(in English) Filling the low resistivity metal aluminum into large-aspect-ratio contact holes is still a important technique employed in the BEOL process of Si ULSI manufacturing. The present work reports the filling capability of CVD-Al/PVD-Al process. In the CVD process, the recently developed material methylpyrrolidine alane (MPA) was used. 0.25μmφ contact holes with an aspect ratio of 4.3 has been successfully filled by CVD-AL/PVD process. The relative reflectivity of Al-CVD/Al-PVD film against Si surface was 215% @480nm. Fourier-Transform Infrared-Spectroscopy (FT-IR) measurements has confirmed that (l)MPA is decomposed into methylpyrrolidine and alane, and (2) the decomposition of alane.
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Keyword(in English) Al-CVD / methylpyrrolidine alane / FT-IR / Contact
Paper # SDM2002-227
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Committee SDM
Conference Date 2003/1/31(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Al CVD Technology using MPA (methylpyrrolidine alane)
Sub Title (in English)
Keyword(1) Al-CVD
Keyword(2) methylpyrrolidine alane
Keyword(3) FT-IR
Keyword(4) Contact
1st Author's Name Manabu Sakamoto
1st Author's Affiliation Precision and Intelligence Laboratory, Tokyo Institute of Technology()
2nd Author's Name Kazuya Masu
2nd Author's Affiliation Precision and Intelligence Laboratory, Tokyo Institute of Technology
3rd Author's Name Eri Sugimoto
3rd Author's Affiliation Institute for Semiconductor Technologies, ULVAC Inc.
4th Author's Name Jin Il Lee
4th Author's Affiliation Institute for Semiconductor Technologies, ULVAC Inc.
5th Author's Name Masanobu Hatanaka
5th Author's Affiliation Institute for Semiconductor Technologies, ULVAC Inc.
6th Author's Name Yoshikazu Takahashi
6th Author's Affiliation Institute for Semiconductor Technologies, ULVAC Inc.
7th Author's Name Michio Ishikawa
7th Author's Affiliation Institute for Semiconductor Technologies, ULVAC Inc.
8th Author's Name Yuji Furumura
8th Author's Affiliation Philbridge
Date 2003/1/31
Paper # SDM2002-227
Volume (vol) vol.102
Number (no) 637
Page pp.pp.-
#Pages 5
Date of Issue