Presentation 2003/8/28
Ohmic Contact Mechanism of Al-Mo Alloy Electrode to n-InP Substrate
Mayumi B. TAKEYAMA, Atsushi NOYA, Tamotsu HASHIZUME, Hideki HASEGAWA,
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Abstract(in English) We have investigated an Al_xMo_<1-x> alloy as an ohmic electrode material to obtain a thermally stable ohmic electrode with low contact resistance. The novel metallization scheme of Al_<0.9>Mo_<0.1>/n-InP demonstrated an ohmic characteristic without regard to annealing. It was found that the ohmic behavior was correlated to the diffusion of Al with Mo into the InP substrate, forming thin AlInP layer at the InP interface. A simple estimation using the model-solid theory predicted a small band discontinuity between InP and the strained AlInP layer. This is one of possible reasons for the observed ohmic characteristics. It was also suggested that Al-Mo bonds forming the Al_<12>Mo intermetallic compound or its precursor proceed the exchange reaction between Al and In atoms into the InP substrate.
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Keyword(in English) InP / ohmic contact / Al-Mo alloy / lattice distortion
Paper # R2003-39,ED2003-117
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Conference Date 2003/8/28(1days)
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Language JPN
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Title (in English) Ohmic Contact Mechanism of Al-Mo Alloy Electrode to n-InP Substrate
Sub Title (in English)
Keyword(1) InP
Keyword(2) ohmic contact
Keyword(3) Al-Mo alloy
Keyword(4) lattice distortion
1st Author's Name Mayumi B. TAKEYAMA
1st Author's Affiliation Department of Electrical and Electronic Engineering, Kitami Institute of Technology()
2nd Author's Name Atsushi NOYA
2nd Author's Affiliation Department of Electrical and Electronic Engineering, Kitami Institute of Technology
3rd Author's Name Tamotsu HASHIZUME
3rd Author's Affiliation Research Center for Integrated Quantum Electronics, Hokkaido University
4th Author's Name Hideki HASEGAWA
4th Author's Affiliation Research Center for Integrated Quantum Electronics, Hokkaido University
Date 2003/8/28
Paper # R2003-39,ED2003-117
Volume (vol) vol.103
Number (no) 275
Page pp.pp.-
#Pages 4
Date of Issue