| Presentation | 2002/11/8 Effect of temperature cycles on the moisture resistance of semiconductor package Masashi Nishimura, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Semiconductor packages are, in general, subjected to both thermo-mechanical stress and moisture effect in an actual use environment, and therefore, it is a matter of concern that the delamination and micro crack induced by periodic temperature change would degrade moisture resistance. The effect of temperature cycles on the moisture resistance was evaluated, using two types of packages (EBGA and PBGA), by the Sequential Stress test, comprised of temperature cycling followed by moisture-proof test (HAST or PCT). In EBGA package, it was confirmed that the temperature cycling stress would increase moisture absorptivity and would change the package micro-structure, although little electrical failure was observed. Considering the packaging technology future trend of further miniaturization, such as narrower pitch design of wirings on BGA laminate, etc., it might be crucial to perform the Sequential Stress test to assess moisture resistance, because of its capability of earlier detection of potential failure. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Semiconductor package / Moisture resistance / Temperature cycles / Sequential test |
| Paper # | R2002-36 |
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| Conference Information | |
| Committee | R |
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| Conference Date | 2002/11/8(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Effect of temperature cycles on the moisture resistance of semiconductor package |
| Sub Title (in English) | |
| Keyword(1) | Semiconductor package |
| Keyword(2) | Moisture resistance |
| Keyword(3) | Temperature cycles |
| Keyword(4) | Sequential test |
| 1st Author's Name | Masashi Nishimura |
| 1st Author's Affiliation | ITES Co., Ltd.() |
| Date | 2002/11/8 |
| Paper # | R2002-36 |
| Volume (vol) | vol.102 |
| Number (no) | 454 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |