| Presentation | 2002/11/8 Joint reliability evaluation methods of a BGA solder ball terminal Kiyoshi SEKINAGA, Koichi MATUSHITA, Hiroshi MATUSHIMA, Tetsuaki WADA, |
|---|---|
| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In recently, a lot of BGA (ball grid array) packages, which are one of the semiconductor packages, are used to the reduction of the mounting area of the printed wiring board. The ball share strength measurement is generally used as a method of evaluating the joint quality between ball terminal of this BGA package and BGA package substrate. However, there was a problem of not detecting an abnormal connection of the interface easily because the ball share strength measurement was a method of measuring share strength in parallel for the substrate of the BGA package. We investigated the new ball share strength measurement method, which can detect the abnormal connection of the interface. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Solder Ball / Joint Strength / BGA |
| Paper # | R2002-34 |
| Date of Issue |
| Conference Information | |
| Committee | R |
|---|---|
| Conference Date | 2002/11/8(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Joint reliability evaluation methods of a BGA solder ball terminal |
| Sub Title (in English) | |
| Keyword(1) | Solder Ball |
| Keyword(2) | Joint Strength |
| Keyword(3) | BGA |
| 1st Author's Name | Kiyoshi SEKINAGA |
| 1st Author's Affiliation | QA Semiconductor Company Matsushita Electric Industrial Co., LTD() |
| 2nd Author's Name | Koichi MATUSHITA |
| 2nd Author's Affiliation | QA Semiconductor Company Matsushita Electric Industrial Co., LTD |
| 3rd Author's Name | Hiroshi MATUSHIMA |
| 3rd Author's Affiliation | QA Semiconductor Company Matsushita Electric Industrial Co., LTD |
| 4th Author's Name | Tetsuaki WADA |
| 4th Author's Affiliation | QA Semiconductor Company Matsushita Electric Industrial Co., LTD |
| Date | 2002/11/8 |
| Paper # | R2002-34 |
| Volume (vol) | vol.102 |
| Number (no) | 454 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |