| Presentation | 2002/11/8 A Study on Lead Free Soldering Connection for Throuhole PWB (3) Sadanori ITO, Toru YASUI, Masao TAKEMURA, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper is described on the effect of leadless and high soldering temperature for PWB. The result indicated that a amount of cupper leaching is varied by solder-material, and a failure appeared in lower-level manufacturing process. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Lead Free Soldering / Cupper Leaching |
| Paper # | R2002-33 |
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| Conference Information | |
| Committee | R |
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| Conference Date | 2002/11/8(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Reliability(R) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A Study on Lead Free Soldering Connection for Throuhole PWB (3) |
| Sub Title (in English) | |
| Keyword(1) | Lead Free Soldering |
| Keyword(2) | Cupper Leaching |
| 1st Author's Name | Sadanori ITO |
| 1st Author's Affiliation | omron co. ltd.() |
| 2nd Author's Name | Toru YASUI |
| 2nd Author's Affiliation | omron co. ltd. |
| 3rd Author's Name | Masao TAKEMURA |
| 3rd Author's Affiliation | omron co. ltd. |
| Date | 2002/11/8 |
| Paper # | R2002-33 |
| Volume (vol) | vol.102 |
| Number (no) | 454 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |