Presentation | 2002/11/8 A Study on Lead Free Soldering Connection for Throuhole PWB (3) Sadanori ITO, Toru YASUI, Masao TAKEMURA, |
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PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | This paper is described on the effect of leadless and high soldering temperature for PWB. The result indicated that a amount of cupper leaching is varied by solder-material, and a failure appeared in lower-level manufacturing process. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Lead Free Soldering / Cupper Leaching |
Paper # | R2002-33 |
Date of Issue |
Conference Information | |
Committee | R |
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Conference Date | 2002/11/8(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Reliability(R) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | A Study on Lead Free Soldering Connection for Throuhole PWB (3) |
Sub Title (in English) | |
Keyword(1) | Lead Free Soldering |
Keyword(2) | Cupper Leaching |
1st Author's Name | Sadanori ITO |
1st Author's Affiliation | omron co. ltd.() |
2nd Author's Name | Toru YASUI |
2nd Author's Affiliation | omron co. ltd. |
3rd Author's Name | Masao TAKEMURA |
3rd Author's Affiliation | omron co. ltd. |
Date | 2002/11/8 |
Paper # | R2002-33 |
Volume (vol) | vol.102 |
Number (no) | 454 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |