Presentation 2002/11/8
A Sulfuration Gas Test for Chip Components With Solder Plating on Silver Termination
Toru YASUI, Sadanori ITO,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) It examined about failure phenomena of the chip components, used for electric components occurred by the sulfuration gas atmosphere. The chip components of test targets have the termination(inner) of silver. As the result, on the chip resistor arrays and the chip resistors, it found that sulfuration silver creap and sulfuration silver whisker expanded between the exterior and the termination(outer). Their phenomena cause short mode by ion migration and open mode by silver exhaustion.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) sulfuration silver creap / sulfuration silver whisker / ion migration / chip resistor arrays / chip resistors
Paper # R2002-32
Date of Issue

Conference Information
Committee R
Conference Date 2002/11/8(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Reliability(R)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Sulfuration Gas Test for Chip Components With Solder Plating on Silver Termination
Sub Title (in English)
Keyword(1) sulfuration silver creap
Keyword(2) sulfuration silver whisker
Keyword(3) ion migration
Keyword(4) chip resistor arrays
Keyword(5) chip resistors
1st Author's Name Toru YASUI
1st Author's Affiliation OMRON Corporation Centralized Purchasing Department()
2nd Author's Name Sadanori ITO
2nd Author's Affiliation OMRON Corporation Centralized Purchasing Department
Date 2002/11/8
Paper # R2002-32
Volume (vol) vol.102
Number (no) 454
Page pp.pp.-
#Pages 6
Date of Issue