Presentation 2003/11/28
Validity of FDTD Simulation on a Transient Analysis of Electromagnetic Field Inside the Metal Package
Takayuki YAMAMOTO, Atsuhiro NISHIKATA,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) As one of the electromagnetic interference problem in a metal package, we study the validity of FDTD calculation by simulating the pulse excitation of microstrip lines surrounded by perfect electric conductor walls. Especially, the comparison with measurement, as well as the comparison between different simulation conditions, are performed, and the preservation of electric power is checked.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Metal package / FDTD method / EMI problem / microstrip lines
Paper # EMCJ2003-120
Date of Issue

Conference Information
Committee EMCJ
Conference Date 2003/11/28(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Validity of FDTD Simulation on a Transient Analysis of Electromagnetic Field Inside the Metal Package
Sub Title (in English)
Keyword(1) Metal package
Keyword(2) FDTD method
Keyword(3) EMI problem
Keyword(4) microstrip lines
1st Author's Name Takayuki YAMAMOTO
1st Author's Affiliation Tokyo Institute of Technology()
2nd Author's Name Atsuhiro NISHIKATA
2nd Author's Affiliation Tokyo Institute of Technology
Date 2003/11/28
Paper # EMCJ2003-120
Volume (vol) vol.103
Number (no) 488
Page pp.pp.-
#Pages 7
Date of Issue