Presentation 2003/10/13
Characteristics of a Low Impedance Line Structure Component mounted in a printed circuit board.
Koichiro MASUDA, Manabu KUSUMOTO, Yoshiaki WAKABAYASHI, Hirokazu TOHYA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Electromagnetic interference (EMI) of electronic equipment is becoming an increasingly important problem as circuits are operated at faster speeds and higher frequencies. The case where a digital circuit is arranged next to an analog circuit is also seen. Power supply decoupling is used as a way to trap the RF power generated by switching of LSI and circuits in the neighborhood of the source and suppress its propagation to the environment. For stable operation of a high-speed circuit we have developed a Low Impedance Line structure Component (LILC). We report the characteristic of the LILC simple substance, and the characteristics of the one mounted in the printed circuit board.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Power supply de-coupling / Transmission line / Line structure component / Conductive polymer
Paper # EMCJ2003-77,MW2003-174
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Committee EMCJ
Conference Date 2003/10/13(1days)
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Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Characteristics of a Low Impedance Line Structure Component mounted in a printed circuit board.
Sub Title (in English)
Keyword(1) Power supply de-coupling
Keyword(2) Transmission line
Keyword(3) Line structure component
Keyword(4) Conductive polymer
1st Author's Name Koichiro MASUDA
1st Author's Affiliation Jisso Research Laboratories, NEC Corporation()
2nd Author's Name Manabu KUSUMOTO
2nd Author's Affiliation Jisso Research Laboratories, NEC Corporation
3rd Author's Name Yoshiaki WAKABAYASHI
3rd Author's Affiliation Jisso Research Laboratories, NEC Corporation
4th Author's Name Hirokazu TOHYA
4th Author's Affiliation Jisso Research Laboratories, NEC Corporation
Date 2003/10/13
Paper # EMCJ2003-77,MW2003-174
Volume (vol) vol.103
Number (no) 369
Page pp.pp.-
#Pages 6
Date of Issue