Presentation 2003/9/5
On effects of a slit on a PCB ground plane interconnection
Hiroshi HIRAYAMA, Yoshio KAMI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Because of the improvement in clock frequency of electric equipment, it is required to reduce far-field emission and to transmit signals without distortion. By the other hands, requests for high-density packaging reduce a margin of design for PCB. Specially, in the case of PCB interconnection, connectors make them worsen. Therefore, it is required to investigate the mechanism of emission and signal transmission, and to give a guide for low-emission and high-signal-integrity designing. In this report, we made experiments to measure near-electromagnetic-field distributions, far-field patterns, and reflection/transmission waveforms. Then we discuss on the results from the viewpoint of emission and signal-integrity.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Emission / Signal integrity / Near-field distribution measurement / Far-field pattern
Paper # EMCJ2003-59
Date of Issue

Conference Information
Committee EMCJ
Conference Date 2003/9/5(1days)
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Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) On effects of a slit on a PCB ground plane interconnection
Sub Title (in English)
Keyword(1) Emission
Keyword(2) Signal integrity
Keyword(3) Near-field distribution measurement
Keyword(4) Far-field pattern
1st Author's Name Hiroshi HIRAYAMA
1st Author's Affiliation Department of Information and Communication Engineering University of Electro-Communications()
2nd Author's Name Yoshio KAMI
2nd Author's Affiliation Department of Information and Communication Engineering University of Electro-Communications
Date 2003/9/5
Paper # EMCJ2003-59
Volume (vol) vol.103
Number (no) 302
Page pp.pp.-
#Pages 6
Date of Issue