| Presentation | 2003/12/5 Transfer Metal Mold Field Emitter Arrays Masayuki Nakamoto, Katsuyoshi Fukuda, Masaki Higa, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The Advanced Transfer Metal Mold emitter fabrication technique has been developed for getting sharp, uniform, low operation voltage and low-FEAs by using the ultra precision machining, the microelectroplating, and the mechanical pressing. The molds are fabricated by Ni electroplating. The Advanced Transfer Metal Mold FEAs are fabricated by the mechanical pressing using Ni Metal Mold and organic resin sheets such as polyimide sheets. Tip radii of the Advanced Transfer Metal Mold organic resin FEAs are 18nm-50nm, depending on the press pressure and the press temperature. I-V characteristics and F-N plots of the Advanced Transfer Metal Mold organic resign FEAs show the electron emissions are caused by field emission mechanisum, and exhibit low turn-on voltage value of 8 V/μm as well as the other Transfer Metal Mold FEAs. The Advanced Transfer Metal Mold technique is appropriate for fabricating sharp, uniform, low operation voltage, lower-cost and highly integrated large area FEAs. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Field Emitter Arrays / Vacuum Nanoelectronics / FEA |
| Paper # | ED2003-181 |
| Date of Issue |
| Conference Information | |
| Committee | ED |
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| Conference Date | 2003/12/5(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electron Devices (ED) |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Transfer Metal Mold Field Emitter Arrays |
| Sub Title (in English) | |
| Keyword(1) | Field Emitter Arrays |
| Keyword(2) | Vacuum Nanoelectronics |
| Keyword(3) | FEA |
| 1st Author's Name | Masayuki Nakamoto |
| 1st Author's Affiliation | Corporate R&D Center, Toshiba Corporation() |
| 2nd Author's Name | Katsuyoshi Fukuda |
| 2nd Author's Affiliation | Corporate R&D Center, Toshiba Corporation |
| 3rd Author's Name | Masaki Higa |
| 3rd Author's Affiliation | Corporate Manufacturing Engineering Center, Toshiba Corporation |
| Date | 2003/12/5 |
| Paper # | ED2003-181 |
| Volume (vol) | vol.103 |
| Number (no) | 497 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |