Presentation 2003/6/23
Shallow Junction formed by UV Pulsed Laser Annealing for Si Micro-Electronics (AWAD2003 (Asia-Pacific Workshop on Fundamental and Application of Advanced Semiconductor Devices))
Takashi NOGUCHI,
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Abstract(in English) UV (Ultra-Violet) laser annealing and relating subject is discussed for the application to Si MOS and SOI (Silicon on Insulator) transistors. In Si LSI, USJ (Ultra-Shallow Junction) of low sheet resistance is required in sub-0.1 μm MOS transistors in order to suppress a SCE (Short Channel Effect) with keeping high on current. ELA (Excimer Laser Annealing) by a uniform energy beam having high absorption rate for silicon layer in UV region is expected as a doping process for the USJ in Si micro-electronics as well as for AM-FPD using TFT. Correspondingly, an effective non-contact analysis for the activated thin junction layer without giving the damage to the Si surface is proposed and is discussed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) USJ / MOS / SOI / UV / Excimer laser
Paper # ED2003-65,SDM2003-76
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Committee ED
Conference Date 2003/6/23(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Shallow Junction formed by UV Pulsed Laser Annealing for Si Micro-Electronics (AWAD2003 (Asia-Pacific Workshop on Fundamental and Application of Advanced Semiconductor Devices))
Sub Title (in English)
Keyword(1) USJ
Keyword(2) MOS
Keyword(3) SOI
Keyword(4) UV
Keyword(5) Excimer laser
1st Author's Name Takashi NOGUCHI
1st Author's Affiliation School of Information and Communication Engineering, Sungyunkwan University:SAIT (Samsung Advanced Institute of Technology)()
Date 2003/6/23
Paper # ED2003-65,SDM2003-76
Volume (vol) vol.103
Number (no) 159
Page pp.pp.-
#Pages 4
Date of Issue